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The Kirkendall void formation in Al/Ti interface during solid-state reactive diffusion between Al and Ti
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| Published in: | Surfaces and interfaces 2017-12, Vol.9, p.196-200 |
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| Main Author: | |
| Format: | Article |
| Language: | English |
| Citations: | Items that this one cites Items that cite this one |
| Online Access: | Get full text |
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| ISSN: | 2468-0230 |
| DOI: | 10.1016/j.surfin.2017.09.013 |