Enhancement of micro hole wetting and hydrogen bubble release in the process of Ni micro electroforming under megasonic field

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Bibliographic Details
Published in:Surfaces and interfaces 2024-01, Vol.44, p.103762, Article 103762
Main Authors: Guo, Bingjiang, Du, Liqun, Wang, Shuai, Cai, Xiaoke, Li, Aoqi, Wang, Zhongmin
Format: Article
Language:English
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ISSN:2468-0230
DOI:10.1016/j.surfin.2023.103762