Constructal heat conduction optimization: Progresses with entransy dissipation rate minimization

• Published in: Thermal science and engineering progress 2018-09, Vol.7, p.155-163
• Main Authors: Wei, Shuhuan, Chen, Lingen, Xie, Zhihui
• Format: Article
• Language: English
• Subjects: Constructal theory; Disc cooling; Electromagnet; Entransy theory; Heat exchanger; ‘Volume-point’ heat conduction
• ISSN: 2451-9049; 2451-9049
• DOI: 10.1016/j.tsep.2018.06.006

•Combining entransy with constructal theory in heat conduction optimization.•Entransy dissipation optimization is taken as objective.•Volume-point heat conduction, disc cooling, heat exchanger, etc. are reviewed. Combining entransy theory with constructal theory in heat transfer optimization, this review summarizes constructal entransy dissipation optimizations of ‘volume-point’ heat conduction problem, optimal design of heat exchangers and multidisciplinary and multi-objective optimization of electromagnets performed in the Naval University of Engineering. It consists of the following four parts: optimization of volume-point heat conduction; optimal design of disc cooling problem; optimal design of cross-profile of a double pipe heat exchanger constituted of porous medium material; and multidisciplinary and multi-objective optimization for electromagnet. Some valuable results for designer are achieved and stated as follows: (1) Whether the heat transfer density is linear increasing is the key for the discrepancies between the two geometries with the objectives of maximum temperature difference minimization (MTDM) and entransy dissipation rate minimization (EDRM). (2) Based on discrete variable cross-profile conductive path, a new constructal basic unit which is more suitable with heat density distribution is established. (3) An index which can reflect magnetic intensity and heat transfer ability at the same time is proposed and multidisciplinary and multi-objective optimizations of electromagnet are realized. (4) A self-similar constructal optimization method which can improve the heat transfer ability steadily through assembling is proposed.