Electrohydrodynamic characteristics in parallel-fin channels and enhanced heat transfer performance of an ionic wind heat sink

• Published in: Thermal science and engineering progress 2024-09, Vol.54, p.102828, Article 102828
• Main Authors: Shen, Wen-jie, Wang, Jing, Li, An, Ji, Yu-qing
• Format: Article
• Language: English
• Subjects: electrohydrodynamic (EHD); Flow characteristic; heat transfer enhancement factor (HTEF); Ionic wind heat sink
• ISSN: 2451-9049
• DOI: 10.1016/j.tsep.2024.102828

•Parallel-fin ionic wind heat sinks were developed for cooling electronic devices.•The body force along the fin channels was examined to understand the mixed flow distribution.•An effective airflow in fin channels was achieved after repositioning the wire electrodes.•The heat transfer enhancement factor increased from 3.07 to 3.72 after optimizing. High heat flux density may lead to a decline in the performance of highly integrated electronic components, which presents a major challenge to thermal management strategies. This work developed ionic wind heat sinks with parallel-fin channels for cooling high-power chips. The study examined the effects of intake air velocity, number of electrodes, and discharge spacing on the distribution of ionic wind flow and the improved heat transfer performance of the ionic wind heat sink. The findings suggest that the ionic wind heat sink with wire electrodes perpendicular to the fin channels can withstand higher operating voltages and generate more reliable corona discharges. The improved heat transfer capabilities are achieved with reduced inlet air velocity. The heat transfer enhancement factor (HTEF) of the ionic wind heat sink decreases as the discharge spacing increases, leading to a reduction in the peak value of the body force. The heat transfer capacity declines as the number of wire electrodes increases, because marginal effects lessen disruption to the thermal boundary layer. An effective airflow is achieved when wire electrodes are positioned upstream of the heat sink and run parallel to the fins, ensuring a steady and efficient cooling process. The design effectively disrupts the thermal boundary layer, reducing momentum loss in the flow and increasing the HTEF value by 21.2%. This improvement significantly enhances the heat dissipation capacity. The structurally optimized heat sink demonstrates excellent overall performance and is a viable option for improving heat dissipation in electronic devices.