Microporous textured titanium dioxide films deposited at atmospheric pressure using dielectric barrier discharge assisted chemical vapor deposition

• Published in: Thin solid films 2008-07, Vol.516 (18), p.6140-6144
• Main Authors: Zhang, X.W., Han, G.R.
• Format: Article
• Language: English
• Subjects: 52.77.-j; 52.80.-s; 68.55.-a; 68.55.Jk; 81.15.Gh; Chemical vapor deposition; Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.); Condensed matter: structure, mechanical and thermal properties; Cross-disciplinary physics: materials science; rheology; Dielectric barrier discharge; Exact sciences and technology; Ion and electron beam-assisted deposition; ion plating; Materials science; Methods of deposition of films and coatings; film growth and epitaxy; Microporous; Physics; Physics of gases, plasmas and electric discharges; Physics of plasmas and electric discharges; Plasma applications; Plasma-based ion implantation and deposition; Structure and morphology; thickness; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties); Thin film structure and morphology; Titanium dioxide thin film
• ISSN: 0040-6090; 1879-2731
• DOI: 10.1016/j.tsf.2007.11.019

Titanium dioxide films are prepared by dielectric barrier discharge assisted chemical vapor deposition, under a wide range of working pressures from 200 Pa to atmospheric pressure. Measurements of scanning electron microscopy and X-ray diffraction are performed to investigate the microstructure of the thin films. As the titanium dioxide film is deposited under atmospheric pressure, a microporous textured surface film is identified, which might be attributed to the preferred orientation of film growth induced by the localized filamentary discharge. By comparison, the microporous textured titanium dioxide films deposited at atmospheric pressure show two times higher photocatalytic activity than those deposited under low pressures, whereas both of their hydrophilic activities are almost the same.