Electron backscatter diffraction analysis of electrodeposited nano-scale copper wires

• Published in: Thin solid films 2013-07, Vol.539, p.207-214
• Main Authors: Ke, Y., Konkova, T., Mironov, S., Tamahashi, K., Onuki, J.
• Format: Article
• Language: English
• Subjects: Condensed matter: electronic structure, electrical, magnetic, and optical properties; Condensed matter: structure, mechanical and thermal properties; Copper; Cross-disciplinary physics: materials science; rheology; Electrical properties of specific thin films; Electrodeposition; Electrodeposition, electroplating; Electron backscatter diffraction; Electronic structure and electrical properties of surfaces, interfaces, thin films and low-dimensional structures; Exact sciences and technology; Materials science; Methods of deposition of films and coatings; film growth and epitaxy; Nano-crystalline; Nanoscale materials and structures: fabrication and characterization; Physics; Quantum wires; Structure and morphology; thickness; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties); Thin film structure and morphology
• ISSN: 0040-6090; 1879-2731
• DOI: 10.1016/j.tsf.2013.05.067

The high-resolution electron backscatter diffraction technique was applied to study grain-size, misorientation distribution and texture, which affect resistivity substantially, in electrodeposited and subsequently annealed nano-scale (80nm width) copper wires. Particular emphasis was given to the examination of the variation of the microstructural parameters and texture in the trench thickness direction. The bottom part of the wires was shown to be characterized by the largest proportion of low-angle boundaries and the lowest fraction of annealing twins. The crystallographic texture of the wires was also demonstrated to significantly change in thickness direction. Depending on the trench height, the close packed {111} plane was shown to align either with the side walls or the bottom surface. •Texture distribution is essentially inhomogeneous in the line depth direction.•The material contains significant proportions of low-angle and twin boundaries.•The material is the least recrystallized in the bottom part of the lines.