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Influence of substrate temperature on properties of pyrite thin films deposited using a sequential coevaporation technique

A series of pyrite thin films were deposited in-situ in a monolayer-by-monolayer fashion using sequential evaporation of iron under high vacuum, followed by sulfidation at a sulfur pressure of 133 Pa, as a function of substrate temperature. The stoichiometry, crystallinity, topographic smoothness, a...

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Bibliographic Details
Published in:Thin solid films 2019-01, Vol.669, p.49-55
Main Authors: Walimbe, A., Wertheim, A., Ravi, A., Kopas, Cameron, Saxena, A., Singh, R.K., Lehner, S.W., Domenico, John, Makar, James, Carpenter, R.W., Buseck, P.R., Newman, N.
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Language:English
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Summary:A series of pyrite thin films were deposited in-situ in a monolayer-by-monolayer fashion using sequential evaporation of iron under high vacuum, followed by sulfidation at a sulfur pressure of 133 Pa, as a function of substrate temperature. The stoichiometry, crystallinity, topographic smoothness, and phase purity of the deposited pyrite thin films improve with increasing substrate temperature up to 420 °C, the highest temperature studied. Characterization of the films deposited at 420 °C using selected-area precession electron diffraction, Raman Spectroscopy, and conventional X-ray diffraction indicated that the pyrite layer is phase pure, with no evidence of a secondary marcasite phase, and grew in columnar grains with a preferential (100) orientation on the (100) silicon substrates. This novel sequential evaporation technique has the potential to make useful low-cost semiconducting pyrite materials for large-area electronic applications. •A sequential vapor deposition method produced high–quality, pyrite thin films•Films deposited at >400 °C exhibit ideal stoichiometry and ~100% phase purity.•Film grown at 420 °C have columnar grains with pyrite (100)||(100) Si substrate.
ISSN:0040-6090
1879-2731
DOI:10.1016/j.tsf.2018.10.022