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Influence of nickel incorporation in CdS: Structural and electrical studies

•Ni doped cubic phase CdS thin film was deposited by chemical bath deposition.•Particle size and Band gap decreases with Ni incorporation.•The Urbach energy increases with Ni doping.•AC conductivity increases with Ni doping while impedance decreases. Microstructural properties of CdS thin film synth...

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Bibliographic Details
Published in:Thin solid films 2020-06, Vol.704, p.138005, Article 138005
Main Authors: Mukherjee, Ayan, Das, Mahima Ranjan, Banerjee, Ankita, Mitra, Partha
Format: Article
Language:English
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Summary:•Ni doped cubic phase CdS thin film was deposited by chemical bath deposition.•Particle size and Band gap decreases with Ni incorporation.•The Urbach energy increases with Ni doping.•AC conductivity increases with Ni doping while impedance decreases. Microstructural properties of CdS thin film synthesized by chemical bath deposition method and influence of Ni were studied in this present work. X-ray diffraction and selected area electron diffraction pattern reveal the presence of cubic phase. Energy dispersive X-ray analysis confirmed the presence of Ni element in nearly stoichiometric films. The particle size of CdS (~16-26 nm) decreased with nickel doping. Bandgap was found to decrease from ~2.41 eV to ~2.24 eV with increase in nickel incorporation. The Urbach energy increases with Ni doping suggesting increase in disorder in the film. The electrical conductivity and dielectric property were investigated in detail using complex impedance spectroscopy. Conductivity increases with the incorporation of Ni in CdS.
ISSN:0040-6090
1879-2731
DOI:10.1016/j.tsf.2020.138005