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Development of poly (methyl methacrylate)-supported transfer technique of single-wall carbon nanotube conductive films for flexible devices

•Possibility of flexible electronic device using single-wall carbon nanotube films.•Transfer of films fabricated on high heat-resistant Cu to flexible substrates.•The transferred films have high electrical conductivity and flexibility. We propose a transfer technique of single-wall carbon nanotube (...

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Published in:Thin solid films 2021-10, Vol.736, p.138904, Article 138904
Main Authors: Kuromatsu, Sho, Watanabe, Takeshi, Nonoguchi, Yoshiyuki, Kawai, Tsuyoshi, Koh, Shinji
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cited_by cdi_FETCH-LOGICAL-c406t-7ded36e41596f5e5a20e43033786e4e3860b662105ffc2169f3872706b73405f3
cites cdi_FETCH-LOGICAL-c406t-7ded36e41596f5e5a20e43033786e4e3860b662105ffc2169f3872706b73405f3
container_end_page
container_issue
container_start_page 138904
container_title Thin solid films
container_volume 736
creator Kuromatsu, Sho
Watanabe, Takeshi
Nonoguchi, Yoshiyuki
Kawai, Tsuyoshi
Koh, Shinji
description •Possibility of flexible electronic device using single-wall carbon nanotube films.•Transfer of films fabricated on high heat-resistant Cu to flexible substrates.•The transferred films have high electrical conductivity and flexibility. We propose a transfer technique of single-wall carbon nanotube (SWCNT) films to be applied to a wide variety of flexible electronic devices. SWCNT films were first heat-treated in advance to remove solvents and dispersants in the films on high heat-resistant Cu substrates and were then poly (methyl methacrylate)-supported transferred onto low heat-resistant polyethylene terephthalate and paper substrates. We characterized the flexibility and electrical properties of the films transferred by this technique. The transferred films showed high flexibility and high electrical conductivity (8.4 × 104 ∼ 1.1 × 105 S/m). X-ray photoelectron spectroscopy measurements revealed that the transferred films were free from Fe residues. Although a slight amount of the Cu residues existed, it was found that the residues did not contributed to the electrical conduction. By using this technique, we enabled to fabricate highly flexible and highly electrical conductive SWCNT films on flexible substrates with low heat resistance, which provide further potential for the application of these films to flexible electronic devices.
doi_str_mv 10.1016/j.tsf.2021.138904
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fullrecord <record><control><sourceid>elsevier_cross</sourceid><recordid>TN_cdi_crossref_primary_10_1016_j_tsf_2021_138904</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S0040609021003874</els_id><sourcerecordid>S0040609021003874</sourcerecordid><originalsourceid>FETCH-LOGICAL-c406t-7ded36e41596f5e5a20e43033786e4e3860b662105ffc2169f3872706b73405f3</originalsourceid><addsrcrecordid>eNp9kE1LKzEYhYMoWD9-gLssvYupb5JpZgZXF71-gOBG1yGTeaMpaTImabW_wT99p9S1qwMHnsPhIeSCwZwBk1fLecl2zoGzORNtB_UBmbG26SreCHZIZgA1VBI6OCYnOS8BgHEuZuT7Fjfo47jCUGi0dIx-Sy9XWN63nu5Cm7T1uuCfKq_HMaaCAy1Jh2wx0YLmPbiPNe7Q7MKbx-pTe0-NTn0MNOgQy7pHamIY1qa4DVLr_CpTGxO1Hr9c75EOuHEG8xk5stpnPP_JU_J69-_l5qF6er5_vPn7VJkaZKmaAQchsWaLTtoFLjQHrAUI0bRTi6KV0EvJGSysNZzJzoq24Q3IvhH1VIpTwva7JsWcE1o1JrfSaasYqJ1NtVSTTbWzqfY2J-Z6z-B0bOMwqWwcBoODS2iKGqL7hf4Pert_6w</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Development of poly (methyl methacrylate)-supported transfer technique of single-wall carbon nanotube conductive films for flexible devices</title><source>ScienceDirect Freedom Collection</source><creator>Kuromatsu, Sho ; Watanabe, Takeshi ; Nonoguchi, Yoshiyuki ; Kawai, Tsuyoshi ; Koh, Shinji</creator><creatorcontrib>Kuromatsu, Sho ; Watanabe, Takeshi ; Nonoguchi, Yoshiyuki ; Kawai, Tsuyoshi ; Koh, Shinji</creatorcontrib><description>•Possibility of flexible electronic device using single-wall carbon nanotube films.•Transfer of films fabricated on high heat-resistant Cu to flexible substrates.•The transferred films have high electrical conductivity and flexibility. We propose a transfer technique of single-wall carbon nanotube (SWCNT) films to be applied to a wide variety of flexible electronic devices. SWCNT films were first heat-treated in advance to remove solvents and dispersants in the films on high heat-resistant Cu substrates and were then poly (methyl methacrylate)-supported transferred onto low heat-resistant polyethylene terephthalate and paper substrates. We characterized the flexibility and electrical properties of the films transferred by this technique. The transferred films showed high flexibility and high electrical conductivity (8.4 × 104 ∼ 1.1 × 105 S/m). X-ray photoelectron spectroscopy measurements revealed that the transferred films were free from Fe residues. Although a slight amount of the Cu residues existed, it was found that the residues did not contributed to the electrical conduction. By using this technique, we enabled to fabricate highly flexible and highly electrical conductive SWCNT films on flexible substrates with low heat resistance, which provide further potential for the application of these films to flexible electronic devices.</description><identifier>ISSN: 0040-6090</identifier><identifier>EISSN: 1879-2731</identifier><identifier>DOI: 10.1016/j.tsf.2021.138904</identifier><language>eng</language><publisher>Elsevier B.V</publisher><subject>Electrical conductivity ; Flexible device ; Ink ; Single-wall carbon nanotube ; Transfer</subject><ispartof>Thin solid films, 2021-10, Vol.736, p.138904, Article 138904</ispartof><rights>2021</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c406t-7ded36e41596f5e5a20e43033786e4e3860b662105ffc2169f3872706b73405f3</citedby><cites>FETCH-LOGICAL-c406t-7ded36e41596f5e5a20e43033786e4e3860b662105ffc2169f3872706b73405f3</cites><orcidid>0000-0002-4246-284X ; 0000-0002-6836-6231 ; 0000-0002-4614-4814</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids></links><search><creatorcontrib>Kuromatsu, Sho</creatorcontrib><creatorcontrib>Watanabe, Takeshi</creatorcontrib><creatorcontrib>Nonoguchi, Yoshiyuki</creatorcontrib><creatorcontrib>Kawai, Tsuyoshi</creatorcontrib><creatorcontrib>Koh, Shinji</creatorcontrib><title>Development of poly (methyl methacrylate)-supported transfer technique of single-wall carbon nanotube conductive films for flexible devices</title><title>Thin solid films</title><description>•Possibility of flexible electronic device using single-wall carbon nanotube films.•Transfer of films fabricated on high heat-resistant Cu to flexible substrates.•The transferred films have high electrical conductivity and flexibility. We propose a transfer technique of single-wall carbon nanotube (SWCNT) films to be applied to a wide variety of flexible electronic devices. SWCNT films were first heat-treated in advance to remove solvents and dispersants in the films on high heat-resistant Cu substrates and were then poly (methyl methacrylate)-supported transferred onto low heat-resistant polyethylene terephthalate and paper substrates. We characterized the flexibility and electrical properties of the films transferred by this technique. The transferred films showed high flexibility and high electrical conductivity (8.4 × 104 ∼ 1.1 × 105 S/m). X-ray photoelectron spectroscopy measurements revealed that the transferred films were free from Fe residues. Although a slight amount of the Cu residues existed, it was found that the residues did not contributed to the electrical conduction. By using this technique, we enabled to fabricate highly flexible and highly electrical conductive SWCNT films on flexible substrates with low heat resistance, which provide further potential for the application of these films to flexible electronic devices.</description><subject>Electrical conductivity</subject><subject>Flexible device</subject><subject>Ink</subject><subject>Single-wall carbon nanotube</subject><subject>Transfer</subject><issn>0040-6090</issn><issn>1879-2731</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2021</creationdate><recordtype>article</recordtype><recordid>eNp9kE1LKzEYhYMoWD9-gLssvYupb5JpZgZXF71-gOBG1yGTeaMpaTImabW_wT99p9S1qwMHnsPhIeSCwZwBk1fLecl2zoGzORNtB_UBmbG26SreCHZIZgA1VBI6OCYnOS8BgHEuZuT7Fjfo47jCUGi0dIx-Sy9XWN63nu5Cm7T1uuCfKq_HMaaCAy1Jh2wx0YLmPbiPNe7Q7MKbx-pTe0-NTn0MNOgQy7pHamIY1qa4DVLr_CpTGxO1Hr9c75EOuHEG8xk5stpnPP_JU_J69-_l5qF6er5_vPn7VJkaZKmaAQchsWaLTtoFLjQHrAUI0bRTi6KV0EvJGSysNZzJzoq24Q3IvhH1VIpTwva7JsWcE1o1JrfSaasYqJ1NtVSTTbWzqfY2J-Z6z-B0bOMwqWwcBoODS2iKGqL7hf4Pert_6w</recordid><startdate>20211031</startdate><enddate>20211031</enddate><creator>Kuromatsu, Sho</creator><creator>Watanabe, Takeshi</creator><creator>Nonoguchi, Yoshiyuki</creator><creator>Kawai, Tsuyoshi</creator><creator>Koh, Shinji</creator><general>Elsevier B.V</general><scope>AAYXX</scope><scope>CITATION</scope><orcidid>https://orcid.org/0000-0002-4246-284X</orcidid><orcidid>https://orcid.org/0000-0002-6836-6231</orcidid><orcidid>https://orcid.org/0000-0002-4614-4814</orcidid></search><sort><creationdate>20211031</creationdate><title>Development of poly (methyl methacrylate)-supported transfer technique of single-wall carbon nanotube conductive films for flexible devices</title><author>Kuromatsu, Sho ; Watanabe, Takeshi ; Nonoguchi, Yoshiyuki ; Kawai, Tsuyoshi ; Koh, Shinji</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c406t-7ded36e41596f5e5a20e43033786e4e3860b662105ffc2169f3872706b73405f3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2021</creationdate><topic>Electrical conductivity</topic><topic>Flexible device</topic><topic>Ink</topic><topic>Single-wall carbon nanotube</topic><topic>Transfer</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Kuromatsu, Sho</creatorcontrib><creatorcontrib>Watanabe, Takeshi</creatorcontrib><creatorcontrib>Nonoguchi, Yoshiyuki</creatorcontrib><creatorcontrib>Kawai, Tsuyoshi</creatorcontrib><creatorcontrib>Koh, Shinji</creatorcontrib><collection>CrossRef</collection><jtitle>Thin solid films</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Kuromatsu, Sho</au><au>Watanabe, Takeshi</au><au>Nonoguchi, Yoshiyuki</au><au>Kawai, Tsuyoshi</au><au>Koh, Shinji</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Development of poly (methyl methacrylate)-supported transfer technique of single-wall carbon nanotube conductive films for flexible devices</atitle><jtitle>Thin solid films</jtitle><date>2021-10-31</date><risdate>2021</risdate><volume>736</volume><spage>138904</spage><pages>138904-</pages><artnum>138904</artnum><issn>0040-6090</issn><eissn>1879-2731</eissn><abstract>•Possibility of flexible electronic device using single-wall carbon nanotube films.•Transfer of films fabricated on high heat-resistant Cu to flexible substrates.•The transferred films have high electrical conductivity and flexibility. We propose a transfer technique of single-wall carbon nanotube (SWCNT) films to be applied to a wide variety of flexible electronic devices. SWCNT films were first heat-treated in advance to remove solvents and dispersants in the films on high heat-resistant Cu substrates and were then poly (methyl methacrylate)-supported transferred onto low heat-resistant polyethylene terephthalate and paper substrates. We characterized the flexibility and electrical properties of the films transferred by this technique. The transferred films showed high flexibility and high electrical conductivity (8.4 × 104 ∼ 1.1 × 105 S/m). X-ray photoelectron spectroscopy measurements revealed that the transferred films were free from Fe residues. Although a slight amount of the Cu residues existed, it was found that the residues did not contributed to the electrical conduction. By using this technique, we enabled to fabricate highly flexible and highly electrical conductive SWCNT films on flexible substrates with low heat resistance, which provide further potential for the application of these films to flexible electronic devices.</abstract><pub>Elsevier B.V</pub><doi>10.1016/j.tsf.2021.138904</doi><orcidid>https://orcid.org/0000-0002-4246-284X</orcidid><orcidid>https://orcid.org/0000-0002-6836-6231</orcidid><orcidid>https://orcid.org/0000-0002-4614-4814</orcidid><oa>free_for_read</oa></addata></record>
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subjects Electrical conductivity
Flexible device
Ink
Single-wall carbon nanotube
Transfer
title Development of poly (methyl methacrylate)-supported transfer technique of single-wall carbon nanotube conductive films for flexible devices
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-24T16%3A57%3A43IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-elsevier_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Development%20of%20poly%20(methyl%20methacrylate)-supported%20transfer%20technique%20of%20single-wall%20carbon%20nanotube%20conductive%20films%20for%20flexible%20devices&rft.jtitle=Thin%20solid%20films&rft.au=Kuromatsu,%20Sho&rft.date=2021-10-31&rft.volume=736&rft.spage=138904&rft.pages=138904-&rft.artnum=138904&rft.issn=0040-6090&rft.eissn=1879-2731&rft_id=info:doi/10.1016/j.tsf.2021.138904&rft_dat=%3Celsevier_cross%3ES0040609021003874%3C/elsevier_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c406t-7ded36e41596f5e5a20e43033786e4e3860b662105ffc2169f3872706b73405f3%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true