Preparation and atomic oxygen erosion resistance of SiOx coating formed on polyimide film by plasma polymer deposition

• Published in: Vacuum 2019-07, Vol.165, p.7-11
• Main Authors: Mu, Huifeng, Wang, Xue, Li, Zhonghua, Xie, Yuanyuan, Gao, Yuan, Liu, Huitao
• Format: Article
• Language: English
• Subjects: Atomic oxygen; Plasma polymerization; Polyimide; SiOx coating
• ISSN: 0042-207X; 1879-2715
• DOI: 10.1016/j.vacuum.2019.03.047

It is very important for the polyimide film that a dense and uniform SiOx coating on its surface to resist atomic oxygen (AO) erosion. In this paper, an improved plasma polymerization process is employed to prepare a SiOx protective coating on the surface of Kapton. A deposition process is transited gradually from organic layer to inorganic layer by varying the ratio of O2/Ar and a uniform and compact organic-inorganic hybrid coating is easily formed. The samples are tested by AO irradiation in a ground-based simulator. When the total AO fluence is up to 1.09 × 1022 atoms/cm2, the uncoated sample has already been eroded and broken completely. On the contrary, though the color of coated sample has turned dark, but the sample still keeps intact. The AO erosion yield of coated sample is sharply down, equivalent to only 6.0% of pristine Kapton. •The SiOx coating was gradually grown from organic to inorganic layer through plasma polymerization.•The adhesion between the SiOx coating and Kapton substrate can be enhanced by the gradient deposition process.•After atomic oxygen exposure 1.09 × 1022 atom/cm2, the coated Kapton kept perfectly.