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Fabrication of polycrystalline silicon thin films by gold-induced crystallization of amorphous silicon suboxide
In this work, polycrystalline silicon (poly-Si) thin films were synthesized using Au-induced crystallization of amorphous silicon suboxide for the first time. The structure and elemental composition of the substrate/Au/a-SiO0.4 stacked structure annealed at 500–700°C were investigated by transmissio...
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Published in: | Vacuum 2021-10, Vol.192, p.110462, Article 110462 |
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Main Authors: | , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | In this work, polycrystalline silicon (poly-Si) thin films were synthesized using Au-induced crystallization of amorphous silicon suboxide for the first time. The structure and elemental composition of the substrate/Au/a-SiO0.4 stacked structure annealed at 500–700°C were investigated by transmission electron microscopy (TEM), Raman, and energy-dispersive X-ray spectroscopy (EDX). TEM and Raman methods confirmed the formation of a poly-Si thin film in the bottom layer (on the substrate) as a result of annealing. At the same time, TEM and EDX studies showed the formation of a thin (barrier) SiO2 layer with a thickness of ~5 nm located between the poly-Si thin film and the upper layer consisting of Au, Si, and O. Based on the results, a mechanism for the growth of poly-Si thin films is proposed which has features (dewetting of Au films and formation of a barrier SiO2 layer) that are not characteristic of the well-known layer exchange process.
•Poly-Si thin films were synthesized using Au-induced crystallization of a-SiOx for the first time•Formation of a poly-Si thin film in the bottom layer (on the substrate) as a result of annealing•Formation of a thin (barrier) SiO2 5-nm-thick layer located between a poly-Si thin film and an upper layer•A mechanism for the growth of poly-Si thin films is proposed |
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ISSN: | 0042-207X 1879-2715 |
DOI: | 10.1016/j.vacuum.2021.110462 |