Direct Imaging of Integrated Circuits in CPU with 60 nm Super-Resolution Optical Microscope

• Published in: Nano letters 2021-05, Vol.21 (9), p.3887-3893
• Main Authors: Yang, Guang, Yang, Chi, Chen, Yage, Yu, Boyu, Bi, Yali, Liao, Jiangshan, Li, Haozheng, Wang, Hong, Wang, Yuxi, Liu, Ziyu, Gan, Zongsong, Yuan, Quan, Wang, Yi, Xia, Jinsong, Wang, Ping
• Format: Article
• Language: English
• ISSN: 1530-6984; 1530-6992
• DOI: 10.1021/acs.nanolett.1c00403

Far-field super-resolution optical microscopies have achieved incredible success in life science for visualization of vital nanostructures organized in single cells. However, such resolution power has been much less extended to material science for inspection of human-made ultrafine nanostructures, simply because the current super-resolution optical microscopies modalities are rarely applicable to nonfluorescent samples or unlabeled systems. Here, we report an antiphase demodulation pump–probe (DPP) super-resolution microscope for direct optical inspection of integrated circuits (ICs) with a lateral resolution down to 60 nm. Because of the strong pump–probe (PP) signal from copper, we performed label-free super-resolution imaging of multilayered copper interconnects on a small central processing unit (CPU) chip. The label-free super-resolution DPP optical microscopy opens possibilities for easy, fast, and large-scale electronic inspection in the whole pipeline chain for designing and manufacturing ICs.