Gamma-Ray Irradiation Induced Dielectric Loss of SiO 2 /Si Heterostructures in Through-Silicon Vias (TSVs) by Forming Border Traps

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Bibliographic Details
Published in:ACS applied electronic materials 2024-02, Vol.6 (2), p.1339-1346
Main Authors: Zhang, Guanghui, Yang, Zenghui, Li, Xiaoshi, Deng, Shuairong, Liu, Yang, Zhou, Hang, Peng, Maoyang, Fu, Zhengping, Chen, Rui, Meng, Dechao, Zhong, Le, Zhou, Quanfeng, Wei, Su-Huai
Format: Article
Language:English
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ISSN:2637-6113
2637-6113
DOI:10.1021/acsaelm.3c01646