Photocatalytic CO 2 Reduction Enabled by Interfacial S-Scheme Heterojunction between Ultrasmall Copper Phosphosulfide and g-C 3 N 4

• Published in: ACS applied materials & interfaces 2021-03, Vol.13 (8), p.9762-9770
• Main Authors: Zhang, Xiandi, Kim, Daekyu, Yan, Jia, Lee, Lawrence Yoon Suk
• Format: Article
• Language: English
• ISSN: 1944-8244; 1944-8252
• DOI: 10.1021/acsami.0c17926

Transition metal phosphosulfides (TMPSs) have gained much interest due to their highly enhanced photocatalytic activities compared to their corresponding phosphides and sulfides. However, the application of TMPSs on photocatalytic CO reduction remains a challenge due to their inappropriate band positions and rapid recombination of photogenerated electron-hole pairs. Herein, we report ultrasmall copper phosphosulfide (us-Cu P|S) nanocrystals anchored on 2D g-C N nanosheets. Systematic studies on the interaction between us-Cu P|S and g-C N indicate the formation of an S-scheme heterojunction via interfacial P-N chemical bonds, which acts as an electron transfer channel and facilitates the separation and migration of photogenerated charge carriers. Upon the composite formation, the band structures of us-Cu P|S and g-C N are altered to enable the enhanced photocatalytic CO generation rate of 137 μmol g h , which is eight times higher than that of pristine g-C N . The unique phosphosulfide structure is also beneficial for the enhanced electron transfer rate and provides abundant active sites. This first application of Cu P|S to photocatalytic CO reduction marks an important step toward the development of TMPSs for photocatalytic applications.