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Hydrophobic AlO x Surfaces by Adsorption of a SAM on Large Areas for Application in Solar Cell Metallization Patterning
A resist-free metallization of copper-plated contacts is attractive to replace screen-printed silver contacts and is demonstrated on large-area silicon heterojunction (SHJ) solar cells. In our approach, a self-passivated Al layer is used as a mask during the plating process. In this study, Al/AlO x...
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Published in: | ACS applied materials & interfaces 2021-02, Vol.13 (4), p.5803-5813 |
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container_title | ACS applied materials & interfaces |
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creator | Hatt, Thibaud Bartsch, Jonas Davis, Victoria Richter, Armin Kluska, Sven Glunz, Stefan W Glatthaar, Markus Fischer, Anna |
description | A resist-free metallization of copper-plated contacts is attractive to replace screen-printed silver contacts and is demonstrated on large-area silicon heterojunction (SHJ) solar cells. In our approach, a self-passivated Al layer is used as a mask during the plating process. In this study, Al/AlO x or Al2O3 plating masks are further functionalized by a self-assembled monolayer (SAM) of octadecyl phosphonic acid (ODPA). The ODPA adsorption is characterized by X-ray photoelectron spectroscopy (XPS), Fourier transform infrared spectroscopy in attenuated total reflectance (FTIR-ATR) (in situ), and contact angle measurements to link the surface chemical composition to wetting properties. The SAM leads to homogeneous hydrophobic surfaces on large-area textured solar cells and planar flexible printed circuit boards (PCBs), which allows reproducible patterning of narrow lines by inkjet printing of an etchant. Selective copper plating is then performed to complete the metallization process and produce Cu contacts in the patterned areas. Silicon heterojunction (SHJ) solar cells metallized by the complete sequence reached up to 22.4% efficiency on a large area. |
doi_str_mv | 10.1021/acsami.0c20134 |
format | article |
fullrecord | <record><control><sourceid>acs_cross</sourceid><recordid>TN_cdi_crossref_primary_10_1021_acsami_0c20134</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>c788737723</sourcerecordid><originalsourceid>FETCH-LOGICAL-a1428-39587267e6740b5ea78b1f069c5c43cba40703c866f8278c7bbb7f2cfa203db43</originalsourceid><addsrcrecordid>eNp1kM9LwzAYhoMobk6vHiVnoTO_2rTHMtQJkwnTc0nSZGZkTUk6dP71Vjt38_S98D3vx8cDwDVGU4wIvhMqiq2dIkUQpuwEjHHBWJKTlJweM2MjcBHjBqGMEpSegxGlrCAFy8fgY76vg2_fvbQKlm4JP-FqF4xQOkK5h2UdfWg76xvoDRRwVT7DPi9EWGtYBi0iND7Asm2dVeKXsw1ceScCnGnn4LPuhHP2a9i9iK7TobHN-hKcGeGivjrMCXh7uH-dzZPF8vFpVi4SgRnJE1qkOScZ1xlnSKZa8Fxig7JCpYpRJQVDHFGVZ5nJCc8Vl1JyQ5QRBNFaMjoB0-GuCj7GoE3VBrsVYV9hVP0YrAaD1cFgX7gZCu1ObnV9xP-U9cDtAPTFauN3oen__-_aNzDce18</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Hydrophobic AlO x Surfaces by Adsorption of a SAM on Large Areas for Application in Solar Cell Metallization Patterning</title><source>American Chemical Society:Jisc Collections:American Chemical Society Read & Publish Agreement 2022-2024 (Reading list)</source><creator>Hatt, Thibaud ; Bartsch, Jonas ; Davis, Victoria ; Richter, Armin ; Kluska, Sven ; Glunz, Stefan W ; Glatthaar, Markus ; Fischer, Anna</creator><creatorcontrib>Hatt, Thibaud ; Bartsch, Jonas ; Davis, Victoria ; Richter, Armin ; Kluska, Sven ; Glunz, Stefan W ; Glatthaar, Markus ; Fischer, Anna</creatorcontrib><description>A resist-free metallization of copper-plated contacts is attractive to replace screen-printed silver contacts and is demonstrated on large-area silicon heterojunction (SHJ) solar cells. In our approach, a self-passivated Al layer is used as a mask during the plating process. In this study, Al/AlO x or Al2O3 plating masks are further functionalized by a self-assembled monolayer (SAM) of octadecyl phosphonic acid (ODPA). The ODPA adsorption is characterized by X-ray photoelectron spectroscopy (XPS), Fourier transform infrared spectroscopy in attenuated total reflectance (FTIR-ATR) (in situ), and contact angle measurements to link the surface chemical composition to wetting properties. The SAM leads to homogeneous hydrophobic surfaces on large-area textured solar cells and planar flexible printed circuit boards (PCBs), which allows reproducible patterning of narrow lines by inkjet printing of an etchant. Selective copper plating is then performed to complete the metallization process and produce Cu contacts in the patterned areas. Silicon heterojunction (SHJ) solar cells metallized by the complete sequence reached up to 22.4% efficiency on a large area.</description><identifier>ISSN: 1944-8244</identifier><identifier>EISSN: 1944-8252</identifier><identifier>DOI: 10.1021/acsami.0c20134</identifier><identifier>PMID: 33492948</identifier><language>eng</language><publisher>United States: American Chemical Society</publisher><subject>Surfaces, Interfaces, and Applications</subject><ispartof>ACS applied materials & interfaces, 2021-02, Vol.13 (4), p.5803-5813</ispartof><rights>2021 The Authors. Published by American Chemical Society</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-a1428-39587267e6740b5ea78b1f069c5c43cba40703c866f8278c7bbb7f2cfa203db43</citedby><cites>FETCH-LOGICAL-a1428-39587267e6740b5ea78b1f069c5c43cba40703c866f8278c7bbb7f2cfa203db43</cites><orcidid>0000-0002-9443-9668</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,27901,27902</link.rule.ids><backlink>$$Uhttps://www.ncbi.nlm.nih.gov/pubmed/33492948$$D View this record in MEDLINE/PubMed$$Hfree_for_read</backlink></links><search><creatorcontrib>Hatt, Thibaud</creatorcontrib><creatorcontrib>Bartsch, Jonas</creatorcontrib><creatorcontrib>Davis, Victoria</creatorcontrib><creatorcontrib>Richter, Armin</creatorcontrib><creatorcontrib>Kluska, Sven</creatorcontrib><creatorcontrib>Glunz, Stefan W</creatorcontrib><creatorcontrib>Glatthaar, Markus</creatorcontrib><creatorcontrib>Fischer, Anna</creatorcontrib><title>Hydrophobic AlO x Surfaces by Adsorption of a SAM on Large Areas for Application in Solar Cell Metallization Patterning</title><title>ACS applied materials & interfaces</title><addtitle>ACS Appl. Mater. Interfaces</addtitle><description>A resist-free metallization of copper-plated contacts is attractive to replace screen-printed silver contacts and is demonstrated on large-area silicon heterojunction (SHJ) solar cells. In our approach, a self-passivated Al layer is used as a mask during the plating process. In this study, Al/AlO x or Al2O3 plating masks are further functionalized by a self-assembled monolayer (SAM) of octadecyl phosphonic acid (ODPA). The ODPA adsorption is characterized by X-ray photoelectron spectroscopy (XPS), Fourier transform infrared spectroscopy in attenuated total reflectance (FTIR-ATR) (in situ), and contact angle measurements to link the surface chemical composition to wetting properties. The SAM leads to homogeneous hydrophobic surfaces on large-area textured solar cells and planar flexible printed circuit boards (PCBs), which allows reproducible patterning of narrow lines by inkjet printing of an etchant. Selective copper plating is then performed to complete the metallization process and produce Cu contacts in the patterned areas. Silicon heterojunction (SHJ) solar cells metallized by the complete sequence reached up to 22.4% efficiency on a large area.</description><subject>Surfaces, Interfaces, and Applications</subject><issn>1944-8244</issn><issn>1944-8252</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2021</creationdate><recordtype>article</recordtype><recordid>eNp1kM9LwzAYhoMobk6vHiVnoTO_2rTHMtQJkwnTc0nSZGZkTUk6dP71Vjt38_S98D3vx8cDwDVGU4wIvhMqiq2dIkUQpuwEjHHBWJKTlJweM2MjcBHjBqGMEpSegxGlrCAFy8fgY76vg2_fvbQKlm4JP-FqF4xQOkK5h2UdfWg76xvoDRRwVT7DPi9EWGtYBi0iND7Asm2dVeKXsw1ceScCnGnn4LPuhHP2a9i9iK7TobHN-hKcGeGivjrMCXh7uH-dzZPF8vFpVi4SgRnJE1qkOScZ1xlnSKZa8Fxig7JCpYpRJQVDHFGVZ5nJCc8Vl1JyQ5QRBNFaMjoB0-GuCj7GoE3VBrsVYV9hVP0YrAaD1cFgX7gZCu1ObnV9xP-U9cDtAPTFauN3oen__-_aNzDce18</recordid><startdate>20210203</startdate><enddate>20210203</enddate><creator>Hatt, Thibaud</creator><creator>Bartsch, Jonas</creator><creator>Davis, Victoria</creator><creator>Richter, Armin</creator><creator>Kluska, Sven</creator><creator>Glunz, Stefan W</creator><creator>Glatthaar, Markus</creator><creator>Fischer, Anna</creator><general>American Chemical Society</general><scope>NPM</scope><scope>AAYXX</scope><scope>CITATION</scope><orcidid>https://orcid.org/0000-0002-9443-9668</orcidid></search><sort><creationdate>20210203</creationdate><title>Hydrophobic AlO x Surfaces by Adsorption of a SAM on Large Areas for Application in Solar Cell Metallization Patterning</title><author>Hatt, Thibaud ; Bartsch, Jonas ; Davis, Victoria ; Richter, Armin ; Kluska, Sven ; Glunz, Stefan W ; Glatthaar, Markus ; Fischer, Anna</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-a1428-39587267e6740b5ea78b1f069c5c43cba40703c866f8278c7bbb7f2cfa203db43</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2021</creationdate><topic>Surfaces, Interfaces, and Applications</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Hatt, Thibaud</creatorcontrib><creatorcontrib>Bartsch, Jonas</creatorcontrib><creatorcontrib>Davis, Victoria</creatorcontrib><creatorcontrib>Richter, Armin</creatorcontrib><creatorcontrib>Kluska, Sven</creatorcontrib><creatorcontrib>Glunz, Stefan W</creatorcontrib><creatorcontrib>Glatthaar, Markus</creatorcontrib><creatorcontrib>Fischer, Anna</creatorcontrib><collection>PubMed</collection><collection>CrossRef</collection><jtitle>ACS applied materials & interfaces</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Hatt, Thibaud</au><au>Bartsch, Jonas</au><au>Davis, Victoria</au><au>Richter, Armin</au><au>Kluska, Sven</au><au>Glunz, Stefan W</au><au>Glatthaar, Markus</au><au>Fischer, Anna</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Hydrophobic AlO x Surfaces by Adsorption of a SAM on Large Areas for Application in Solar Cell Metallization Patterning</atitle><jtitle>ACS applied materials & interfaces</jtitle><addtitle>ACS Appl. Mater. Interfaces</addtitle><date>2021-02-03</date><risdate>2021</risdate><volume>13</volume><issue>4</issue><spage>5803</spage><epage>5813</epage><pages>5803-5813</pages><issn>1944-8244</issn><eissn>1944-8252</eissn><abstract>A resist-free metallization of copper-plated contacts is attractive to replace screen-printed silver contacts and is demonstrated on large-area silicon heterojunction (SHJ) solar cells. In our approach, a self-passivated Al layer is used as a mask during the plating process. In this study, Al/AlO x or Al2O3 plating masks are further functionalized by a self-assembled monolayer (SAM) of octadecyl phosphonic acid (ODPA). The ODPA adsorption is characterized by X-ray photoelectron spectroscopy (XPS), Fourier transform infrared spectroscopy in attenuated total reflectance (FTIR-ATR) (in situ), and contact angle measurements to link the surface chemical composition to wetting properties. The SAM leads to homogeneous hydrophobic surfaces on large-area textured solar cells and planar flexible printed circuit boards (PCBs), which allows reproducible patterning of narrow lines by inkjet printing of an etchant. Selective copper plating is then performed to complete the metallization process and produce Cu contacts in the patterned areas. Silicon heterojunction (SHJ) solar cells metallized by the complete sequence reached up to 22.4% efficiency on a large area.</abstract><cop>United States</cop><pub>American Chemical Society</pub><pmid>33492948</pmid><doi>10.1021/acsami.0c20134</doi><tpages>11</tpages><orcidid>https://orcid.org/0000-0002-9443-9668</orcidid></addata></record> |
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subjects | Surfaces, Interfaces, and Applications |
title | Hydrophobic AlO x Surfaces by Adsorption of a SAM on Large Areas for Application in Solar Cell Metallization Patterning |
url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-07T12%3A47%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-acs_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Hydrophobic%20AlO%20x%20Surfaces%20by%20Adsorption%20of%20a%20SAM%20on%20Large%20Areas%20for%20Application%20in%20Solar%20Cell%20Metallization%20Patterning&rft.jtitle=ACS%20applied%20materials%20&%20interfaces&rft.au=Hatt,%20Thibaud&rft.date=2021-02-03&rft.volume=13&rft.issue=4&rft.spage=5803&rft.epage=5813&rft.pages=5803-5813&rft.issn=1944-8244&rft.eissn=1944-8252&rft_id=info:doi/10.1021/acsami.0c20134&rft_dat=%3Cacs_cross%3Ec788737723%3C/acs_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-a1428-39587267e6740b5ea78b1f069c5c43cba40703c866f8278c7bbb7f2cfa203db43%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/33492948&rfr_iscdi=true |