Metallization of Polyamide-imide for High-Frequency Communication by Polyethylenimine Modification and Electroless Copper Plating

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Bibliographic Details
Published in:ACS applied polymer materials 2023-12, Vol.5 (12), p.10032-10041
Main Authors: Zhang, Hao-wen, Huang, Meng-Lin, Luo, Jian-qiang, Xu, Zhao-quan, Chen, Yuan-ming, Feng, Zhe-sheng, Wang, Yan
Format: Article
Language:English
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ISSN:2637-6105
2637-6105
DOI:10.1021/acsapm.3c01903