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All-Solution-Processed High-Performance MoS 2 Thin-Film Transistors with a Quasi-2D Perovskite Oxide Dielectric
Assembling solution-processed van der Waals ( ) materials into thin films holds great promise for constructing large-scale, high-performance thin-film electronics, especially at low temperatures. While transition metal dichalcogenide thin films assembled in solution have shown potential as channel m...
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Published in: | ACS nano 2024-01, Vol.18 (3), p.1958-1968 |
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Main Authors: | , , , , , , , , , , , , , , |
Format: | Article |
Language: | English |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Assembling solution-processed van der Waals (
) materials into thin films holds great promise for constructing large-scale, high-performance thin-film electronics, especially at low temperatures. While transition metal dichalcogenide thin films assembled in solution have shown potential as channel materials, fully solution-processed
electronics have not been achieved due to the absence of suitable dielectric materials and high-temperature processing. In this work, we report on all-solution-processed
thin-film transistors (TFTs) comprising molybdenum disulfides (MoS
) as the channel and Dion-Jacobson-phase perovskite oxides as the high-permittivity dielectric. The constituent layers are prepared as colloidal solutions through electrochemical exfoliation of bulk crystals, followed by sequential assembly into a semiconductor/dielectric heterostructure for TFT construction. Notably, all fabrication processes are carried out at temperatures below 250 °C. The fabricated MoS
TFTs exhibit excellent device characteristics, including high mobility (>10 cm
V
s
) and an on/off ratio exceeding 10
. Additionally, the use of a high-
dielectric allows for operation at low voltage (∼5 V) and leakage current (∼10
A), enabling low power consumption. Our demonstration of the low-temperature fabrication of high-performance TFTs presents a cost-effective and scalable approach for heterointegrated thin-film electronics. |
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ISSN: | 1936-0851 1936-086X |
DOI: | 10.1021/acsnano.3c06972 |