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Synergistic effect of CuInSe 2 alloying on enhancing the thermoelectric performance of Cu 2 SnSe 3 compounds
Cu 2 SnSe 3 based compounds with a diamond-like structure are promising thermoelectric materials. However, the relatively high lattice thermal conductivity limits further improvement in their thermoelectric performance. In this work, two compounds including In 2 Se 3 and CuInSe 2 are employed to all...
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Published in: | Journal of materials chemistry. A, Materials for energy and sustainability Materials for energy and sustainability, 2020-10, Vol.8 (40), p.21181-21188 |
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Main Authors: | , , , , , , , , , , |
Format: | Article |
Language: | English |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Cu
2
SnSe
3
based compounds with a diamond-like structure are promising thermoelectric materials. However, the relatively high lattice thermal conductivity limits further improvement in their thermoelectric performance. In this work, two compounds including In
2
Se
3
and CuInSe
2
are employed to alloy with Cu
2
SnSe
3
aiming to decrease lattice thermal conductivity and their corresponding effects are compared. It is found that alloying with CuInSe
2
is more beneficial to reduce lattice thermal conductivity and maintain the power factor, as evidenced by a higher quality factor
B
. Subsequently, both In and Ga doping is performed to regulate the carrier concentration of (Cu
2
SnSe
3
)
0.80
(CuInSe
2
)
0.2
. Finally, (Cu
2
Sn
0.97
Ga
0.03
Se
3
)
0.80
(CuInSe
2
)
0.20
displays a decent
zT
of ∼0.98 at 823 K, a nearly six-fold higher value compared to that of the pristine sample. Additionally, a
zT
ave
of ∼0.35 over 300–823 K is obtained in (Cu
2
Sn
0.97
Ga
0.03
Se
3
)
0.80
(CuInSe
2
)
0.20
, which is among the best reported p-type Cu
2
SnSe
3
based compounds. The result proves that alloying with CuInSe
2
combined with carrier concentration optimization is a valid strategy to improve the thermoelectric performance of Cu
2
SnSe
3
based compounds. |
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ISSN: | 2050-7488 2050-7496 |
DOI: | 10.1039/D0TA07211G |