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Improved electrochemical performance of nitrogen-containing copper-based 1D metal organic framework derived from highly connective pyridine-2,4,6-tricarboxylic acid for hybrid supercapacitors

Metal organic frameworks (MOFs) are promising candidates for emergent energy storage devices due to their intrinsic properties, such as rich porosity, variable nano-geometries, and multifunctional characteristics. Here, we report the synthesis of copper-based MOFs (Cu-PTA-MOF), polyaniline (PANI), a...

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Bibliographic Details
Published in:Journal of materials chemistry. A, Materials for energy and sustainability Materials for energy and sustainability, 2025
Main Authors: Shahbaz, Muhammad, Sharif, Shahzad, Mushtaq, Muhammad Waheed, Ghaznazvi, Zainab, Iqbal, Zaeema, Khurshid, Muhammad Aqib, Şahin, Onur, Shahzad, Sundas, Saeed, Maham, Shahzad, Ayesha
Format: Article
Language:English
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Summary:Metal organic frameworks (MOFs) are promising candidates for emergent energy storage devices due to their intrinsic properties, such as rich porosity, variable nano-geometries, and multifunctional characteristics. Here, we report the synthesis of copper-based MOFs (Cu-PTA-MOF), polyaniline (PANI), and polypyrrole (PPY), which have been characterized using different techniques. Pyridine-2,4,6-tricarboxylic acid (PTA) ligands were connected by metal ions through π–d conjugated layers to generate the 1D polymer. Electrochemical attributes of Cu-PTA-MOF@AC, Cu-PTA-MOF@PANI and Cu-PTA-MOF@PPY were explored using a three-electrode assembly with 1 M KOH. Cu-PTA-MOF@PANI exhibited good results. For practical application, it was coupled with an activated carbon electrode in a hybrid supercapacitor device. The device exhibits a specific capacity of 232 C g −1 , 72.5 W h kg −1 energy density and 4500 W kg −1 power density at 0.5 A g −1 current density with a coulombic efficiency of 98.8% even after 10 000 GCD cycles. The conductive polymer endowed the material with rapid ion and electron transfer and allowed utilization of the active material in a hybrid supercapacitor.
ISSN:2050-7488
2050-7496
DOI:10.1039/D4TA05425C