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Biocompatible "click" wafer bonding for microfluidic devices
We introduce a novel dry wafer bonding concept designed for permanent attachment of micromolded polymer structures to surface functionalized silicon substrates. The method, designed for simultaneous fabrication of many lab-on-chip devices, utilizes a chemically reactive polymer microfluidic structur...
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Published in: | Lab on a chip 2012-01, Vol.12 (17), p.332-335 |
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Main Authors: | , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | We introduce a novel dry wafer bonding concept designed for permanent attachment of micromolded polymer structures to surface functionalized silicon substrates. The method, designed for simultaneous fabrication of many lab-on-chip devices, utilizes a chemically reactive polymer microfluidic structure, which rapidly bonds to a functionalized substrate
via
"click" chemistry reactions. The microfluidic structure consists of an off-stoichiometry thiol-ene (OSTE) polymer with a very high density of surface bound thiol groups and the substrate is a silicon wafer that has been functionalized with common bio-linker molecules. We demonstrate here void free, and low temperature (< 37 °C) bonding of a batch of OSTE microfluidic layers to a silane functionalized silicon wafer.
Novel technique to covalently bond OSTE polymer layer to a silicon substrate using dry wafer bonding at low temperature (< 37 °C). |
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ISSN: | 1473-0197 1473-0189 1473-0189 |
DOI: | 10.1039/c2lc21098c |