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Asymmetric strain distributions resulting from deliberately induced misfit dislocations
Misfit dislocations oriented in a specific 〈110〉 direction have been produced in strained Si1−xGex epitaxial layers deposited on Si(001), using sites of localized crystallographic damage as dislocation sources. During a high-temperature anneal, misfit dislocation propagation from a series of paralle...
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Published in: | Applied physics letters 1990-01, Vol.56 (2), p.140-142 |
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Main Authors: | , , , |
Format: | Article |
Language: | English |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Misfit dislocations oriented in a specific 〈110〉 direction have been produced in strained Si1−xGex epitaxial layers deposited on Si(001), using sites of localized crystallographic damage as dislocation sources. During a high-temperature anneal, misfit dislocation propagation from a series of parallel saw lines oriented along a particular 〈110〉 direction led to asymmetrically strained material demonstrating an orthorhombic symmetry. Processing conditions required to maximize [110]/[11̄0] asymmetry in the strain distribution are discussed. The distance of a dislocation front emanating from the sites of crystallographic damage during a high-temperature anneal has been used to measure the misfit dislocation glide velocity. |
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ISSN: | 0003-6951 1077-3118 |
DOI: | 10.1063/1.103054 |