Fluorine-enhanced boron diffusion in amorphous silicon

Silicon wafers were preamorphized with 70 keV Si+ at a dose of 1×1015 atoms/cm2, generating a deep amorphous layer of 1800 Å. Implants of 500 eV B+11, with and without 6 keV F+, followed at doses of 1×1015 atoms/cm2 and 2×1015 atoms/cm2, respectively. After annealing at 550 °C, secondary ion mass sp...

Full description

Saved in:
Bibliographic Details
Published in:Applied physics letters 2003-05, Vol.82 (20), p.3469-3471
Main Authors: Jacques, J. M., Robertson, L. S., Jones, K. S., Law, M. E., Rendon, Mike, Bennett, Joe
Format: Article
Language:English
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Silicon wafers were preamorphized with 70 keV Si+ at a dose of 1×1015 atoms/cm2, generating a deep amorphous layer of 1800 Å. Implants of 500 eV B+11, with and without 6 keV F+, followed at doses of 1×1015 atoms/cm2 and 2×1015 atoms/cm2, respectively. After annealing at 550 °C, secondary ion mass spectroscopy determined that the diffusivity of boron in amorphous silicon is significantly enhanced in the presence of fluorine. Ellipsometry and cross-sectional transmission electron microscopy indicate the enhanced diffusion only occurs in the amorphous layer. Fluorine increases the boron diffusivity by approximately five orders of magnitude at 550 °C. It is proposed that the ability of fluorine to reduce the dangling bond concentration in amorphous silicon may reduce the formation energy for mobile boron, enhancing its diffusivity.
ISSN:0003-6951
1077-3118
DOI:10.1063/1.1576508