HILLOCKS AS STRUCTURAL MARKERS FOR ELECTROMIGRATION RATE MEASUREMENTS IN THIN FILMS

A simple experiment is presented to measure the rate of solute mass transport (electromigration) in dilute alloy thin-film conductors. A structural marker motion method was employed to determine the rate of copper movement (average ion velocity=4.5×10−8 cm/sec) in Al–Cu thin films during electrical...

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Bibliographic Details
Published in:Applied physics letters 1971-04, Vol.18 (8), p.344-346
Main Authors: Howard, J.K., Ross, R. F.
Format: Article
Language:English
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Summary:A simple experiment is presented to measure the rate of solute mass transport (electromigration) in dilute alloy thin-film conductors. A structural marker motion method was employed to determine the rate of copper movement (average ion velocity=4.5×10−8 cm/sec) in Al–Cu thin films during electrical stress (4.7×105 A/cm2 at 150 °C ambient temperature).
ISSN:0003-6951
1077-3118
DOI:10.1063/1.1653690