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Demonstration of chip-to-chip transmission of single-flux-quantum pulses at throughputs beyond 100 Gbps
We report a demonstration of single-flux-quantum (SFQ) pulse transmission between superconductor chips at throughputs beyond 100 Gbps. A fabrication process with a high junction critical current density of 10 kA ∕ cm 2 was used to increase the operation speed of a pulse driver and receiver. The chip...
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Published in: | Applied physics letters 2005-07, Vol.87 (2), p.022502-022502-3 |
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Main Authors: | , , , |
Format: | Article |
Language: | English |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | We report a demonstration of single-flux-quantum (SFQ) pulse transmission between superconductor chips at throughputs beyond 100 Gbps. A fabrication process with a high junction critical current density of
10
kA
∕
cm
2
was used to increase the operation speed of a pulse driver and receiver. The chips were flip-chip bonded on a passive microstrip carrier using small solder bumps with diameters of
30
μ
m
. With experiments based on a ring-shaped circuit, chip-to-chip SFQ pulse transmission has been demonstrated up to 117 Gbps with an error rate of less than
10
−
15
. The power dissipated by the driver and receiver was only
0.24
μ
W
at 117 Gbps. |
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ISSN: | 0003-6951 1077-3118 |
DOI: | 10.1063/1.1993767 |