Stress creation during Ni-Mn alloy electrodeposition

• Published in: Journal of applied physics 2006-03, Vol.99 (5), p.053517-053517-4
• Main Authors: Hearne, Sean J., Floro, Jerrold A., Rodriguez, Mark A., Tissot, Ralph T., Frazer, Colleen S., Brewer, Luke, Hlava, Paul, Foiles, Stephen
• Format: Article
• Language: English
• ISSN: 0021-8979; 1089-7550
• DOI: 10.1063/1.2179138

The stress evolution during electrodeposition of NiMn from a sulfamate-based bath was investigated as a function of Mn concentration and current density. The NiMn stress evolution with film thickness exhibited an initial high transitional stress region followed by a region of steady-state stress with a magnitude that depended on deposition rate, similar to the previously reported stress evolution in electrodeposited Ni [ S. J. Hearne and J. A. Floro , J. Appl. Phys. 97 , 014901-1 ( 2005 ) ]. The incorporation of increasing amounts of Mn resulted in a linear increase in the steady-state stress at constant current density. However, no significant changes in the texture or grain size were observed, which indicates that an atomistic process is driving the changes in steady-state stress. Additionally, microstrain measured by ex situ x-ray diffraction increased with increasing Mn content, which was likely the result of localized lattice distortions associated with substitutional incorporation of Mn and∕or increased twin density.