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Impact of free-surface passivation on silicon on insulator buried interface properties by pseudotransistor characterization
It has been reported previously [ N. Bresson , Proceedings of the ECS Seventh International Symposium on Silicon-on-Insulator Technology and Devices , 2005 (unpublished), pp. 317-324 ; F Allibert , Proceedings of the IEEE International SOI Conference , Honolulu , HI , 2002 (unpublished) ] that the f...
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Published in: | Journal of applied physics 2007-06, Vol.101 (11), p.114513-114513-6 |
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Main Authors: | , , , |
Format: | Article |
Language: | English |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | It has been reported previously [
N. Bresson
,
Proceedings of the ECS Seventh International Symposium on Silicon-on-Insulator Technology and Devices
,
2005
(unpublished), pp.
317-324
;
F Allibert
,
Proceedings of the IEEE International SOI Conference
,
Honolulu
,
HI
,
2002
(unpublished)
] that the film thickness strongly impacts the parameters extracted using the pseudo metal oxide semiconductor field effect transistor (pseudo-MOSFET) with the usual FET equations [
S. Cristoloveanu
and
S. S. Li
,
Electrical Characterization of SOI Materials and Devices
(
Kluwer
,
Boston, MA
,
1995
)
]. In this paper, we investigate the influence of top free-surface states on the pseudo-MOSFET characteristics by comparing passivated versus nonpassivated samples. The parameters of concern, investigated here, are carrier mobility, density of interface states, threshold
(
V
T
)
, and flatband
(
V
FB
)
voltages. Based on systematic measurements and existing models [
H. J. Hovel
,
Solid-State Electron.
47
,
1311
(
2003
)
] for
V
T
,
V
FB
, and subthreshold slope, we show how the free-surface impact increases as the film thickness is reduced. Comparison of extracted results with simulated curves demonstrates that, in state-of-the-art ultrathin silicon on insulator structures, the preparation and properties of the free surface are no longer negligible. |
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ISSN: | 0021-8979 1089-7550 |
DOI: | 10.1063/1.2745398 |