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Physical and electrical characteristics of atomic layer deposited TiN nanocrystal memory capacitors

The physical and electrical characteristics of atomic layer deposited TiN nanocrystals embedded in high- k Al 2 O 3 films in a metal/ Al 2 O 3 ∕ [ Ti N ∕ Al 2 O 3 ] ∕ Si O 2 ∕ p - Si structure have been investigated. High-resolution transmission electron microscopy and x-ray photoelectron spectrosco...

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Bibliographic Details
Published in:Applied physics letters 2007-07, Vol.91 (4), p.043114-043114-3
Main Authors: Maikap, S., Tzeng, P. J., Lee, H. Y., Wang, C. C., Tien, T. C., Lee, L. S., Tsai, M.-J.
Format: Article
Language:English
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Summary:The physical and electrical characteristics of atomic layer deposited TiN nanocrystals embedded in high- k Al 2 O 3 films in a metal/ Al 2 O 3 ∕ [ Ti N ∕ Al 2 O 3 ] ∕ Si O 2 ∕ p - Si structure have been investigated. High-resolution transmission electron microscopy and x-ray photoelectron spectroscopy show the formation of tiny TiN nanocrystals embedded in Al 2 O 3 films after subsequent annealing treatment. The TiN nanocrystals with a high density of > 1 × 10 12 ∕ cm 2 and a small size of < 3 nm have been observed. A large hysteresis memory window of ∼ 4.3 V at small sweeping gate voltage of 3 V has been observed as compared with a pure Al 2 O 3 charge trapping layer, due to highly charge confinement in the TiN metal nanocrystals. The hysteresis memory window of 1.4 V has also been observed under an extremely small sweeping gate voltage of 1 V . A large memory window of ∼ 3.9 V is observed after 10 years of retention. A maximum hysteresis memory window is limited by both of the nanocrystal density and leakage current at a high temperature annealing treatment of the TiN nanocrystal memory capacitors.
ISSN:0003-6951
1077-3118
DOI:10.1063/1.2766680