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Low resistance, nonalloyed Ohmic contacts to InGaAs

We report extremely low specific contact resistivity ( ρ c ) nonalloyed Ohmic contacts to n -type In 0.53 Ga 0.47 As , lattice matched to InP. Contacts were formed by oxidizing the semiconductor surface through exposure to ultraviolet-generated ozone, subsequently immersing the wafer in ammonium hyd...

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Published in:Applied physics letters 2007-11, Vol.91 (19), p.192114-192114-3
Main Authors: Crook, Adam M., Lind, Erik, Griffith, Zach, Rodwell, Mark J. W., Zimmerman, Jeremy D., Gossard, Arthur C., Bank, Seth R.
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cited_by cdi_FETCH-LOGICAL-c349t-69fd55828e94c7c57ae4e824c9ee8e016b4f6549859670226eebe0e3d12fb8463
cites cdi_FETCH-LOGICAL-c349t-69fd55828e94c7c57ae4e824c9ee8e016b4f6549859670226eebe0e3d12fb8463
container_end_page 192114-3
container_issue 19
container_start_page 192114
container_title Applied physics letters
container_volume 91
creator Crook, Adam M.
Lind, Erik
Griffith, Zach
Rodwell, Mark J. W.
Zimmerman, Jeremy D.
Gossard, Arthur C.
Bank, Seth R.
description We report extremely low specific contact resistivity ( ρ c ) nonalloyed Ohmic contacts to n -type In 0.53 Ga 0.47 As , lattice matched to InP. Contacts were formed by oxidizing the semiconductor surface through exposure to ultraviolet-generated ozone, subsequently immersing the wafer in ammonium hydroxide ( N H 4 O H , 14.8 normality), and finally depositing either Ti ∕ Pd ∕ Au contact metal by electron-beam evaporation or TiW contact metal by vacuum sputtering. Ti ∕ Pd ∕ Au contacts exhibited ρ c of ( 0.73 ± 0.44 ) Ω μ m 2 -i.e., ( 7.3 ± 4.4 ) × 10 − 9 Ω cm 2 -while TiW contacts exhibited ρ c of ( 0.84 ± 0.48 ) Ω μ m 2 . The TiW contacts are thermally stable, showing no observable degradation in resistivity after a 500 ° C annealing of 1 min duration.
doi_str_mv 10.1063/1.2806235
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fullrecord <record><control><sourceid>scitation_cross</sourceid><recordid>TN_cdi_crossref_primary_10_1063_1_2806235</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>apl</sourcerecordid><originalsourceid>FETCH-LOGICAL-c349t-69fd55828e94c7c57ae4e824c9ee8e016b4f6549859670226eebe0e3d12fb8463</originalsourceid><addsrcrecordid>eNp1z01LAzEQgOEgCq7Vg_8gV8Gt-f44eChFa2GhFz2HbHYWV7aJbALSf--WFjx5GgZeZngQuqdkSYniT3TJDFGMywtUUaJ1zSk1l6gihPBaWUmv0U3OX_MqGecV4k36wRPkIRcfAzzimKIfx3SADu8-90PAIcXiQ8m4JLyNG7_Kt-iq92OGu_NcoI_Xl_f1W93sNtv1qqkDF7bM3_pOSsMMWBF0kNqDAMNEsAAGCFWt6JUU1kirNGFMAbRAgHeU9a0Rii_Qw-lumFLOE_Tuexr2fjo4StxR66g7a-f2-dTmMBRfhhT_j2ey-yO7o5j_AiD8Wqo</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Low resistance, nonalloyed Ohmic contacts to InGaAs</title><source>American Institute of Physics (AIP) Publications</source><source>American Institute of Physics:Jisc Collections:Transitional Journals Agreement 2021-23 (Reading list)</source><creator>Crook, Adam M. ; Lind, Erik ; Griffith, Zach ; Rodwell, Mark J. W. ; Zimmerman, Jeremy D. ; Gossard, Arthur C. ; Bank, Seth R.</creator><creatorcontrib>Crook, Adam M. ; Lind, Erik ; Griffith, Zach ; Rodwell, Mark J. W. ; Zimmerman, Jeremy D. ; Gossard, Arthur C. ; Bank, Seth R.</creatorcontrib><description>We report extremely low specific contact resistivity ( ρ c ) nonalloyed Ohmic contacts to n -type In 0.53 Ga 0.47 As , lattice matched to InP. Contacts were formed by oxidizing the semiconductor surface through exposure to ultraviolet-generated ozone, subsequently immersing the wafer in ammonium hydroxide ( N H 4 O H , 14.8 normality), and finally depositing either Ti ∕ Pd ∕ Au contact metal by electron-beam evaporation or TiW contact metal by vacuum sputtering. Ti ∕ Pd ∕ Au contacts exhibited ρ c of ( 0.73 ± 0.44 ) Ω μ m 2 -i.e., ( 7.3 ± 4.4 ) × 10 − 9 Ω cm 2 -while TiW contacts exhibited ρ c of ( 0.84 ± 0.48 ) Ω μ m 2 . The TiW contacts are thermally stable, showing no observable degradation in resistivity after a 500 ° C annealing of 1 min duration.</description><identifier>ISSN: 0003-6951</identifier><identifier>EISSN: 1077-3118</identifier><identifier>DOI: 10.1063/1.2806235</identifier><identifier>CODEN: APPLAB</identifier><language>eng</language><publisher>American Institute of Physics</publisher><ispartof>Applied physics letters, 2007-11, Vol.91 (19), p.192114-192114-3</ispartof><rights>2007 American Institute of Physics</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c349t-69fd55828e94c7c57ae4e824c9ee8e016b4f6549859670226eebe0e3d12fb8463</citedby><cites>FETCH-LOGICAL-c349t-69fd55828e94c7c57ae4e824c9ee8e016b4f6549859670226eebe0e3d12fb8463</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://pubs.aip.org/apl/article-lookup/doi/10.1063/1.2806235$$EHTML$$P50$$Gscitation$$H</linktohtml><link.rule.ids>314,776,778,780,791,27901,27902,76352</link.rule.ids></links><search><creatorcontrib>Crook, Adam M.</creatorcontrib><creatorcontrib>Lind, Erik</creatorcontrib><creatorcontrib>Griffith, Zach</creatorcontrib><creatorcontrib>Rodwell, Mark J. W.</creatorcontrib><creatorcontrib>Zimmerman, Jeremy D.</creatorcontrib><creatorcontrib>Gossard, Arthur C.</creatorcontrib><creatorcontrib>Bank, Seth R.</creatorcontrib><title>Low resistance, nonalloyed Ohmic contacts to InGaAs</title><title>Applied physics letters</title><description>We report extremely low specific contact resistivity ( ρ c ) nonalloyed Ohmic contacts to n -type In 0.53 Ga 0.47 As , lattice matched to InP. Contacts were formed by oxidizing the semiconductor surface through exposure to ultraviolet-generated ozone, subsequently immersing the wafer in ammonium hydroxide ( N H 4 O H , 14.8 normality), and finally depositing either Ti ∕ Pd ∕ Au contact metal by electron-beam evaporation or TiW contact metal by vacuum sputtering. Ti ∕ Pd ∕ Au contacts exhibited ρ c of ( 0.73 ± 0.44 ) Ω μ m 2 -i.e., ( 7.3 ± 4.4 ) × 10 − 9 Ω cm 2 -while TiW contacts exhibited ρ c of ( 0.84 ± 0.48 ) Ω μ m 2 . The TiW contacts are thermally stable, showing no observable degradation in resistivity after a 500 ° C annealing of 1 min duration.</description><issn>0003-6951</issn><issn>1077-3118</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2007</creationdate><recordtype>article</recordtype><recordid>eNp1z01LAzEQgOEgCq7Vg_8gV8Gt-f44eChFa2GhFz2HbHYWV7aJbALSf--WFjx5GgZeZngQuqdkSYniT3TJDFGMywtUUaJ1zSk1l6gihPBaWUmv0U3OX_MqGecV4k36wRPkIRcfAzzimKIfx3SADu8-90PAIcXiQ8m4JLyNG7_Kt-iq92OGu_NcoI_Xl_f1W93sNtv1qqkDF7bM3_pOSsMMWBF0kNqDAMNEsAAGCFWt6JUU1kirNGFMAbRAgHeU9a0Rii_Qw-lumFLOE_Tuexr2fjo4StxR66g7a-f2-dTmMBRfhhT_j2ey-yO7o5j_AiD8Wqo</recordid><startdate>20071105</startdate><enddate>20071105</enddate><creator>Crook, Adam M.</creator><creator>Lind, Erik</creator><creator>Griffith, Zach</creator><creator>Rodwell, Mark J. W.</creator><creator>Zimmerman, Jeremy D.</creator><creator>Gossard, Arthur C.</creator><creator>Bank, Seth R.</creator><general>American Institute of Physics</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>20071105</creationdate><title>Low resistance, nonalloyed Ohmic contacts to InGaAs</title><author>Crook, Adam M. ; Lind, Erik ; Griffith, Zach ; Rodwell, Mark J. W. ; Zimmerman, Jeremy D. ; Gossard, Arthur C. ; Bank, Seth R.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c349t-69fd55828e94c7c57ae4e824c9ee8e016b4f6549859670226eebe0e3d12fb8463</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2007</creationdate><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Crook, Adam M.</creatorcontrib><creatorcontrib>Lind, Erik</creatorcontrib><creatorcontrib>Griffith, Zach</creatorcontrib><creatorcontrib>Rodwell, Mark J. W.</creatorcontrib><creatorcontrib>Zimmerman, Jeremy D.</creatorcontrib><creatorcontrib>Gossard, Arthur C.</creatorcontrib><creatorcontrib>Bank, Seth R.</creatorcontrib><collection>CrossRef</collection><jtitle>Applied physics letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Crook, Adam M.</au><au>Lind, Erik</au><au>Griffith, Zach</au><au>Rodwell, Mark J. W.</au><au>Zimmerman, Jeremy D.</au><au>Gossard, Arthur C.</au><au>Bank, Seth R.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Low resistance, nonalloyed Ohmic contacts to InGaAs</atitle><jtitle>Applied physics letters</jtitle><date>2007-11-05</date><risdate>2007</risdate><volume>91</volume><issue>19</issue><spage>192114</spage><epage>192114-3</epage><pages>192114-192114-3</pages><issn>0003-6951</issn><eissn>1077-3118</eissn><coden>APPLAB</coden><abstract>We report extremely low specific contact resistivity ( ρ c ) nonalloyed Ohmic contacts to n -type In 0.53 Ga 0.47 As , lattice matched to InP. Contacts were formed by oxidizing the semiconductor surface through exposure to ultraviolet-generated ozone, subsequently immersing the wafer in ammonium hydroxide ( N H 4 O H , 14.8 normality), and finally depositing either Ti ∕ Pd ∕ Au contact metal by electron-beam evaporation or TiW contact metal by vacuum sputtering. Ti ∕ Pd ∕ Au contacts exhibited ρ c of ( 0.73 ± 0.44 ) Ω μ m 2 -i.e., ( 7.3 ± 4.4 ) × 10 − 9 Ω cm 2 -while TiW contacts exhibited ρ c of ( 0.84 ± 0.48 ) Ω μ m 2 . The TiW contacts are thermally stable, showing no observable degradation in resistivity after a 500 ° C annealing of 1 min duration.</abstract><pub>American Institute of Physics</pub><doi>10.1063/1.2806235</doi></addata></record>
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title Low resistance, nonalloyed Ohmic contacts to InGaAs
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-13T11%3A27%3A30IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-scitation_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Low%20resistance,%20nonalloyed%20Ohmic%20contacts%20to%20InGaAs&rft.jtitle=Applied%20physics%20letters&rft.au=Crook,%20Adam%20M.&rft.date=2007-11-05&rft.volume=91&rft.issue=19&rft.spage=192114&rft.epage=192114-3&rft.pages=192114-192114-3&rft.issn=0003-6951&rft.eissn=1077-3118&rft.coden=APPLAB&rft_id=info:doi/10.1063/1.2806235&rft_dat=%3Cscitation_cross%3Eapl%3C/scitation_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c349t-69fd55828e94c7c57ae4e824c9ee8e016b4f6549859670226eebe0e3d12fb8463%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true