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Epitaxial graphene surface preparation for atomic layer deposition of Al2O3

Atomic layer deposition was employed to deposit relatively thick (∼30 nm) aluminum oxide (Al2O3) using trimethylaluminum and triply-distilled H2O precursors onto epitaxial graphene grown on the Si-face of silicon carbide. Ex situ surface conditioning by a simple wet chemistry treatment was used to r...

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Bibliographic Details
Published in:Journal of applied physics 2011-06, Vol.109 (12)
Main Authors: Garces, N. Y., Wheeler, V. D., Hite, J. K., Jernigan, G. G., Tedesco, J. L., Nepal, Neeraj, Eddy, C. R., Gaskill, D. K.
Format: Article
Language:English
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Summary:Atomic layer deposition was employed to deposit relatively thick (∼30 nm) aluminum oxide (Al2O3) using trimethylaluminum and triply-distilled H2O precursors onto epitaxial graphene grown on the Si-face of silicon carbide. Ex situ surface conditioning by a simple wet chemistry treatment was used to render the otherwise chemically inert graphene surface more amenable to dielectric deposition. The obtained films show excellent morphology and uniformity over large (∼64 mm2) areas (i.e., the entire sample area), as determined by atomic force microscopy and scanning electron microscopy. X-ray photoelectron spectroscopy revealed a nearly stoichiometric film with reduced impurity content. Moreover, from capacitance-voltage measurements a dielectric constant of ∼7.6 was extracted and a positive Dirac voltage shift of ∼1.0 V was observed. The graphene mobility, as determined by van der Pauw Hall measurements, was not affected by the sequence of surface pretreatment and dielectric deposition.
ISSN:0021-8979
1089-7550
DOI:10.1063/1.3596761