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Extremely low temperature formation of silicon dioxide on gallium arsenide
This article demonstrates the growth of silicon dioxide (SiO2) on a gallium arsenide (GaAs) substrate by use of the liquid phase deposition (LPD) method at extremely low temperature (∼40 °C). This method cannot only grow SiO2 but it can also obtain good quality and reliability due to the suppression...
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Published in: | Journal of applied physics 1997-12, Vol.82 (11), p.5788-5792 |
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Language: | English |
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container_end_page | 5792 |
container_issue | 11 |
container_start_page | 5788 |
container_title | Journal of applied physics |
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creator | Houng, M. P. Huang, C. J. Wang, Y. H. Wang, N. F. Chang, W. J. |
description | This article demonstrates the growth of silicon dioxide (SiO2) on a gallium arsenide (GaAs) substrate by use of the liquid phase deposition (LPD) method at extremely low temperature (∼40 °C). This method cannot only grow SiO2 but it can also obtain good quality and reliability due to the suppression of interdiffusion in such a low temperature process. The deposition rate of LPD-SiO2 on GaAs is up to 1265 Å/h. The refractive index of the LPD-SiO2 film on GaAs is about 1.42 with growth at 40 °C. When the LPD-SiO2 film on the GaAs substrate is used to fabricate a metal–oxide–semiconductor capacitor with a device area of 0.3 cm2, the surface charge density (Qss/q) is about 3.7×1011 cm−2 and the leakage current is 43.3 pA at −5 V. A proposed mechanism for the LPD of SiO2 on GaAs is also presented. |
doi_str_mv | 10.1063/1.366445 |
format | article |
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F.</creatorcontrib><creatorcontrib>Chang, W. J.</creatorcontrib><title>Extremely low temperature formation of silicon dioxide on gallium arsenide</title><title>Journal of applied physics</title><description>This article demonstrates the growth of silicon dioxide (SiO2) on a gallium arsenide (GaAs) substrate by use of the liquid phase deposition (LPD) method at extremely low temperature (∼40 °C). This method cannot only grow SiO2 but it can also obtain good quality and reliability due to the suppression of interdiffusion in such a low temperature process. The deposition rate of LPD-SiO2 on GaAs is up to 1265 Å/h. The refractive index of the LPD-SiO2 film on GaAs is about 1.42 with growth at 40 °C. When the LPD-SiO2 film on the GaAs substrate is used to fabricate a metal–oxide–semiconductor capacitor with a device area of 0.3 cm2, the surface charge density (Qss/q) is about 3.7×1011 cm−2 and the leakage current is 43.3 pA at −5 V. 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J.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Extremely low temperature formation of silicon dioxide on gallium arsenide</atitle><jtitle>Journal of applied physics</jtitle><date>1997-12-01</date><risdate>1997</risdate><volume>82</volume><issue>11</issue><spage>5788</spage><epage>5792</epage><pages>5788-5792</pages><issn>0021-8979</issn><eissn>1089-7550</eissn><abstract>This article demonstrates the growth of silicon dioxide (SiO2) on a gallium arsenide (GaAs) substrate by use of the liquid phase deposition (LPD) method at extremely low temperature (∼40 °C). This method cannot only grow SiO2 but it can also obtain good quality and reliability due to the suppression of interdiffusion in such a low temperature process. The deposition rate of LPD-SiO2 on GaAs is up to 1265 Å/h. The refractive index of the LPD-SiO2 film on GaAs is about 1.42 with growth at 40 °C. When the LPD-SiO2 film on the GaAs substrate is used to fabricate a metal–oxide–semiconductor capacitor with a device area of 0.3 cm2, the surface charge density (Qss/q) is about 3.7×1011 cm−2 and the leakage current is 43.3 pA at −5 V. A proposed mechanism for the LPD of SiO2 on GaAs is also presented.</abstract><doi>10.1063/1.366445</doi><tpages>5</tpages></addata></record> |
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title | Extremely low temperature formation of silicon dioxide on gallium arsenide |
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