Electrostatic adhesion testing of thin metallic layers

Testing of the adhesion strength of various metallizations on Si was carried out by a novel electrostatic technique. This technique made possible the evaluation of the characteristic adhesion stress and of the Weibull modulus, the latter being a measure of the distribution of weak adhesion spots. Ad...

Full description

Saved in:
Bibliographic Details
Published in:Journal of applied physics 1999-05, Vol.85 (10), p.7477-7479
Main Authors: Dubec, M., Brotzen, F. R., Dunn, C. F.
Format: Article
Language:English
Citations: Items that this one cites
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Testing of the adhesion strength of various metallizations on Si was carried out by a novel electrostatic technique. This technique made possible the evaluation of the characteristic adhesion stress and of the Weibull modulus, the latter being a measure of the distribution of weak adhesion spots. Adhesion characteristics of various metallic films (Cu, Ti–W, Al–Cu) were determined, and the effect of substrate treatments on these characteristics was analyzed.
ISSN:0021-8979
1089-7550
DOI:10.1063/1.369382