Stress distribution at the AlN/SiC heterointerface probed by Raman spectroscopy

• Published in: Journal of applied physics 2021-02, Vol.129 (5)
• Main Authors: Breev, I. D., Likhachev, K. V., Yakovleva, V. V., Hübner, R., Astakhov, G. V., Baranov, P. G., Mokhov, E. N., Anisimov, A. N.
• Format: Article
• Language: English
• Subjects: Applied physics; Compressive properties; Heterostructures; Lattice vibration; Micrometers; Physical vapor deposition; Raman spectroscopy; Room temperature; Spectrum analysis; Strain distribution; Stress concentration; Stress distribution; Tensors; Thermal expansion
• ISSN: 0021-8979; 1089-7550
• DOI: 10.1063/5.0029682

We grow AlN/4H-SiC and AlN/6H-SiC heterostructures by physical vapor deposition and characterize the heterointerface with micro-scale resolution. We investigate the spatial stress and strain distribution in these heterostructures using confocal Raman spectroscopy. We measure the spectral shifts of various vibrational Raman modes across the heterointerface and along the entire depth of the 4H- and 6H-SiC layers. Using the earlier experimental prediction for the phonon-deformation potential constants, we determine the stress tensor components in SiC as a function of the distance from the AlN/SiC heterointerface. Despite the fact that the lattice parameter of SiC is smaller than that of AlN, the SiC layers are compressively strained at the heterointerface. This counterintuitive behavior is explained by different coefficients of thermal expansion of SiC and AlN when the heterostructures are cooled from growth to room temperature. The compressive stress values are maximum at the heterointerface, approaching 1 GPa, and relax to the equilibrium value on the scale of several tens of micrometers from the heterointerface.