Loading…
Hafnium oxide: A thin film dielectric with controllable etch resistance for semiconductor device fabrication
Thin film dielectrics are ubiquitous in the manufacture of electronic devices and are frequently deposited and etched away at various stages of device fabrication. We demonstrate that hafnium oxide (HfO2) thin films grown via atomic layer deposition on silicon and silicon pre-coated with aluminum ox...
Saved in:
Published in: | AIP advances 2023-06, Vol.13 (6) |
---|---|
Main Authors: | , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
cited_by | cdi_FETCH-LOGICAL-c362t-fe8c1649d14115b1a988bc13af652d7f3c96bd2d238172108b732716f5e7894c3 |
---|---|
cites | cdi_FETCH-LOGICAL-c362t-fe8c1649d14115b1a988bc13af652d7f3c96bd2d238172108b732716f5e7894c3 |
container_end_page | |
container_issue | 6 |
container_start_page | |
container_title | AIP advances |
container_volume | 13 |
creator | Wratten, A. Walker, D. Khorani, E. Healy, B. F. M. Grant, N. E. Murphy, J. D. |
description | Thin film dielectrics are ubiquitous in the manufacture of electronic devices and are frequently deposited and etched away at various stages of device fabrication. We demonstrate that hafnium oxide (HfO2) thin films grown via atomic layer deposition on silicon and silicon pre-coated with aluminum oxide (Al2O3) have etch resistance properties, which can be tuned simply by changing the post-deposition annealing temperature. The etching rates of films in hydrofluoric acid (HF) solutions were found to be dependent on annealing temperature, with the etch rate decreasing with increasing temperature. A transition region in the etch rate was identified between 300 and 350 °C, corresponding to the crystallization of the HfO2 films, as identified via x-ray diffraction. HfO2 films deposited directly onto silicon annealed above 350 °C were resistant to 10% HF solutions over the course of several hours. In the case of Si/Al2O3/HfO2 stacks, closer inspection reveals the existence of channels, which reduces the etch resistance of HF acid, as evidenced by tetramethylammonium hydroxide etching of the silicon substrate. Crystallized HfO2 can be used to protect other dielectrics in device processing, and we demonstrate its use in single-sided fabrication of patterned structures of Al2O3, which can control the effective charge-carrier lifetime in silicon wafers for use in modulating THz and mm-wave radiation. |
doi_str_mv | 10.1063/5.0144639 |
format | article |
fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_crossref_primary_10_1063_5_0144639</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2824123390</sourcerecordid><originalsourceid>FETCH-LOGICAL-c362t-fe8c1649d14115b1a988bc13af652d7f3c96bd2d238172108b732716f5e7894c3</originalsourceid><addsrcrecordid>eNqdkE1LAzEQhoMoWGoP_oOAJ4XVzcdms95KUSsUvOg5ZPNBU3Y3NclW_femtqBn5zIzzMM7vC8Al6i8RSUjd9VtiShlpDkBE4wqXhCM2emf-RzMYtyUuWiDSk4noFtKO7ixh_7TaXMP5zCt3QCt63qonemMSsEp-OHSGio_pOC7TradgSapNQwmupjkoAy0PsBoepchPaqUN212bn-QbVaQyfnhApxZ2UUzO_YpeHt8eF0si9XL0_NivioUYTgV1nCFGG00oghVLZIN561CRFpWYV1bohrWaqwx4ajG2UdbE1wjZitT84YqMgVXB91t8O-jiUls_BiG_FJgjinChDRlpq4PlAo-xmCs2AbXy_AlUCn2eYpKHPPM7M2BjcqlHy__g3c-_IJiqy35Bmwqg6g</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2824123390</pqid></control><display><type>article</type><title>Hafnium oxide: A thin film dielectric with controllable etch resistance for semiconductor device fabrication</title><source>AIP Open Access Journals</source><source>Free Full-Text Journals in Chemistry</source><creator>Wratten, A. ; Walker, D. ; Khorani, E. ; Healy, B. F. M. ; Grant, N. E. ; Murphy, J. D.</creator><creatorcontrib>Wratten, A. ; Walker, D. ; Khorani, E. ; Healy, B. F. M. ; Grant, N. E. ; Murphy, J. D.</creatorcontrib><description>Thin film dielectrics are ubiquitous in the manufacture of electronic devices and are frequently deposited and etched away at various stages of device fabrication. We demonstrate that hafnium oxide (HfO2) thin films grown via atomic layer deposition on silicon and silicon pre-coated with aluminum oxide (Al2O3) have etch resistance properties, which can be tuned simply by changing the post-deposition annealing temperature. The etching rates of films in hydrofluoric acid (HF) solutions were found to be dependent on annealing temperature, with the etch rate decreasing with increasing temperature. A transition region in the etch rate was identified between 300 and 350 °C, corresponding to the crystallization of the HfO2 films, as identified via x-ray diffraction. HfO2 films deposited directly onto silicon annealed above 350 °C were resistant to 10% HF solutions over the course of several hours. In the case of Si/Al2O3/HfO2 stacks, closer inspection reveals the existence of channels, which reduces the etch resistance of HF acid, as evidenced by tetramethylammonium hydroxide etching of the silicon substrate. Crystallized HfO2 can be used to protect other dielectrics in device processing, and we demonstrate its use in single-sided fabrication of patterned structures of Al2O3, which can control the effective charge-carrier lifetime in silicon wafers for use in modulating THz and mm-wave radiation.</description><identifier>ISSN: 2158-3226</identifier><identifier>EISSN: 2158-3226</identifier><identifier>DOI: 10.1063/5.0144639</identifier><identifier>CODEN: AAIDBI</identifier><language>eng</language><publisher>Melville: American Institute of Physics</publisher><subject>Acid resistance ; Aluminum oxide ; Annealing ; Atomic layer epitaxy ; Carrier lifetime ; Controllability ; Crystallization ; Current carriers ; Dielectrics ; Etching ; Hafnium oxide ; Hydrofluoric acid ; Inspection ; Millimeter waves ; Semiconductor devices ; Silicon substrates ; Silicon wafers ; Temperature dependence ; Thin films</subject><ispartof>AIP advances, 2023-06, Vol.13 (6)</ispartof><rights>Author(s)</rights><rights>2023 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c362t-fe8c1649d14115b1a988bc13af652d7f3c96bd2d238172108b732716f5e7894c3</citedby><cites>FETCH-LOGICAL-c362t-fe8c1649d14115b1a988bc13af652d7f3c96bd2d238172108b732716f5e7894c3</cites><orcidid>0000-0002-4382-8575 ; 0009-0000-8475-4851 ; 0000-0003-0993-5972 ; 0000-0002-3943-838X ; 0000-0003-2272-108X ; 0000-0002-8583-4279</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://pubs.aip.org/adv/article-lookup/doi/10.1063/5.0144639$$EHTML$$P50$$Gscitation$$Hfree_for_read</linktohtml><link.rule.ids>314,780,784,27890,27924,27925,76408</link.rule.ids></links><search><creatorcontrib>Wratten, A.</creatorcontrib><creatorcontrib>Walker, D.</creatorcontrib><creatorcontrib>Khorani, E.</creatorcontrib><creatorcontrib>Healy, B. F. M.</creatorcontrib><creatorcontrib>Grant, N. E.</creatorcontrib><creatorcontrib>Murphy, J. D.</creatorcontrib><title>Hafnium oxide: A thin film dielectric with controllable etch resistance for semiconductor device fabrication</title><title>AIP advances</title><description>Thin film dielectrics are ubiquitous in the manufacture of electronic devices and are frequently deposited and etched away at various stages of device fabrication. We demonstrate that hafnium oxide (HfO2) thin films grown via atomic layer deposition on silicon and silicon pre-coated with aluminum oxide (Al2O3) have etch resistance properties, which can be tuned simply by changing the post-deposition annealing temperature. The etching rates of films in hydrofluoric acid (HF) solutions were found to be dependent on annealing temperature, with the etch rate decreasing with increasing temperature. A transition region in the etch rate was identified between 300 and 350 °C, corresponding to the crystallization of the HfO2 films, as identified via x-ray diffraction. HfO2 films deposited directly onto silicon annealed above 350 °C were resistant to 10% HF solutions over the course of several hours. In the case of Si/Al2O3/HfO2 stacks, closer inspection reveals the existence of channels, which reduces the etch resistance of HF acid, as evidenced by tetramethylammonium hydroxide etching of the silicon substrate. Crystallized HfO2 can be used to protect other dielectrics in device processing, and we demonstrate its use in single-sided fabrication of patterned structures of Al2O3, which can control the effective charge-carrier lifetime in silicon wafers for use in modulating THz and mm-wave radiation.</description><subject>Acid resistance</subject><subject>Aluminum oxide</subject><subject>Annealing</subject><subject>Atomic layer epitaxy</subject><subject>Carrier lifetime</subject><subject>Controllability</subject><subject>Crystallization</subject><subject>Current carriers</subject><subject>Dielectrics</subject><subject>Etching</subject><subject>Hafnium oxide</subject><subject>Hydrofluoric acid</subject><subject>Inspection</subject><subject>Millimeter waves</subject><subject>Semiconductor devices</subject><subject>Silicon substrates</subject><subject>Silicon wafers</subject><subject>Temperature dependence</subject><subject>Thin films</subject><issn>2158-3226</issn><issn>2158-3226</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2023</creationdate><recordtype>article</recordtype><sourceid>AJDQP</sourceid><recordid>eNqdkE1LAzEQhoMoWGoP_oOAJ4XVzcdms95KUSsUvOg5ZPNBU3Y3NclW_femtqBn5zIzzMM7vC8Al6i8RSUjd9VtiShlpDkBE4wqXhCM2emf-RzMYtyUuWiDSk4noFtKO7ixh_7TaXMP5zCt3QCt63qonemMSsEp-OHSGio_pOC7TradgSapNQwmupjkoAy0PsBoepchPaqUN212bn-QbVaQyfnhApxZ2UUzO_YpeHt8eF0si9XL0_NivioUYTgV1nCFGG00oghVLZIN561CRFpWYV1bohrWaqwx4ajG2UdbE1wjZitT84YqMgVXB91t8O-jiUls_BiG_FJgjinChDRlpq4PlAo-xmCs2AbXy_AlUCn2eYpKHPPM7M2BjcqlHy__g3c-_IJiqy35Bmwqg6g</recordid><startdate>20230601</startdate><enddate>20230601</enddate><creator>Wratten, A.</creator><creator>Walker, D.</creator><creator>Khorani, E.</creator><creator>Healy, B. F. M.</creator><creator>Grant, N. E.</creator><creator>Murphy, J. D.</creator><general>American Institute of Physics</general><scope>AJDQP</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0002-4382-8575</orcidid><orcidid>https://orcid.org/0009-0000-8475-4851</orcidid><orcidid>https://orcid.org/0000-0003-0993-5972</orcidid><orcidid>https://orcid.org/0000-0002-3943-838X</orcidid><orcidid>https://orcid.org/0000-0003-2272-108X</orcidid><orcidid>https://orcid.org/0000-0002-8583-4279</orcidid></search><sort><creationdate>20230601</creationdate><title>Hafnium oxide: A thin film dielectric with controllable etch resistance for semiconductor device fabrication</title><author>Wratten, A. ; Walker, D. ; Khorani, E. ; Healy, B. F. M. ; Grant, N. E. ; Murphy, J. D.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c362t-fe8c1649d14115b1a988bc13af652d7f3c96bd2d238172108b732716f5e7894c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2023</creationdate><topic>Acid resistance</topic><topic>Aluminum oxide</topic><topic>Annealing</topic><topic>Atomic layer epitaxy</topic><topic>Carrier lifetime</topic><topic>Controllability</topic><topic>Crystallization</topic><topic>Current carriers</topic><topic>Dielectrics</topic><topic>Etching</topic><topic>Hafnium oxide</topic><topic>Hydrofluoric acid</topic><topic>Inspection</topic><topic>Millimeter waves</topic><topic>Semiconductor devices</topic><topic>Silicon substrates</topic><topic>Silicon wafers</topic><topic>Temperature dependence</topic><topic>Thin films</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Wratten, A.</creatorcontrib><creatorcontrib>Walker, D.</creatorcontrib><creatorcontrib>Khorani, E.</creatorcontrib><creatorcontrib>Healy, B. F. M.</creatorcontrib><creatorcontrib>Grant, N. E.</creatorcontrib><creatorcontrib>Murphy, J. D.</creatorcontrib><collection>AIP Open Access Journals</collection><collection>CrossRef</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>AIP advances</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Wratten, A.</au><au>Walker, D.</au><au>Khorani, E.</au><au>Healy, B. F. M.</au><au>Grant, N. E.</au><au>Murphy, J. D.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Hafnium oxide: A thin film dielectric with controllable etch resistance for semiconductor device fabrication</atitle><jtitle>AIP advances</jtitle><date>2023-06-01</date><risdate>2023</risdate><volume>13</volume><issue>6</issue><issn>2158-3226</issn><eissn>2158-3226</eissn><coden>AAIDBI</coden><abstract>Thin film dielectrics are ubiquitous in the manufacture of electronic devices and are frequently deposited and etched away at various stages of device fabrication. We demonstrate that hafnium oxide (HfO2) thin films grown via atomic layer deposition on silicon and silicon pre-coated with aluminum oxide (Al2O3) have etch resistance properties, which can be tuned simply by changing the post-deposition annealing temperature. The etching rates of films in hydrofluoric acid (HF) solutions were found to be dependent on annealing temperature, with the etch rate decreasing with increasing temperature. A transition region in the etch rate was identified between 300 and 350 °C, corresponding to the crystallization of the HfO2 films, as identified via x-ray diffraction. HfO2 films deposited directly onto silicon annealed above 350 °C were resistant to 10% HF solutions over the course of several hours. In the case of Si/Al2O3/HfO2 stacks, closer inspection reveals the existence of channels, which reduces the etch resistance of HF acid, as evidenced by tetramethylammonium hydroxide etching of the silicon substrate. Crystallized HfO2 can be used to protect other dielectrics in device processing, and we demonstrate its use in single-sided fabrication of patterned structures of Al2O3, which can control the effective charge-carrier lifetime in silicon wafers for use in modulating THz and mm-wave radiation.</abstract><cop>Melville</cop><pub>American Institute of Physics</pub><doi>10.1063/5.0144639</doi><tpages>8</tpages><orcidid>https://orcid.org/0000-0002-4382-8575</orcidid><orcidid>https://orcid.org/0009-0000-8475-4851</orcidid><orcidid>https://orcid.org/0000-0003-0993-5972</orcidid><orcidid>https://orcid.org/0000-0002-3943-838X</orcidid><orcidid>https://orcid.org/0000-0003-2272-108X</orcidid><orcidid>https://orcid.org/0000-0002-8583-4279</orcidid><oa>free_for_read</oa></addata></record> |
fulltext | fulltext |
identifier | ISSN: 2158-3226 |
ispartof | AIP advances, 2023-06, Vol.13 (6) |
issn | 2158-3226 2158-3226 |
language | eng |
recordid | cdi_crossref_primary_10_1063_5_0144639 |
source | AIP Open Access Journals; Free Full-Text Journals in Chemistry |
subjects | Acid resistance Aluminum oxide Annealing Atomic layer epitaxy Carrier lifetime Controllability Crystallization Current carriers Dielectrics Etching Hafnium oxide Hydrofluoric acid Inspection Millimeter waves Semiconductor devices Silicon substrates Silicon wafers Temperature dependence Thin films |
title | Hafnium oxide: A thin film dielectric with controllable etch resistance for semiconductor device fabrication |
url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-20T14%3A40%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Hafnium%20oxide:%20A%20thin%20film%20dielectric%20with%20controllable%20etch%20resistance%20for%20semiconductor%20device%20fabrication&rft.jtitle=AIP%20advances&rft.au=Wratten,%20A.&rft.date=2023-06-01&rft.volume=13&rft.issue=6&rft.issn=2158-3226&rft.eissn=2158-3226&rft.coden=AAIDBI&rft_id=info:doi/10.1063/5.0144639&rft_dat=%3Cproquest_cross%3E2824123390%3C/proquest_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c362t-fe8c1649d14115b1a988bc13af652d7f3c96bd2d238172108b732716f5e7894c3%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=2824123390&rft_id=info:pmid/&rfr_iscdi=true |