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Structural effects on thermal conductivity of micro-thick Li4Ti5O12-based anode

This study investigates the structural effects on the cross-plane thermal conductivity of Li4Ti5O12-based anode active material. Three structures are investigated: a basic structure consisting of LiBr/LiCl/Li4Ti5O12, polyvinylidene difluoride, and Super P (sample #1); a structure without Li4Ti5O12 (...

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Bibliographic Details
Published in:Journal of applied physics 2024-06, Vol.135 (23)
Main Authors: Rahbar, Mahya, Wang, Ying, Xu, Shen, Cheng, Wenlong, Wang, Xinwei
Format: Article
Language:English
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Summary:This study investigates the structural effects on the cross-plane thermal conductivity of Li4Ti5O12-based anode active material. Three structures are investigated: a basic structure consisting of LiBr/LiCl/Li4Ti5O12, polyvinylidene difluoride, and Super P (sample #1); a structure without Li4Ti5O12 (sample #2); and a structure without LiBr/LiCl (sample #3). Despite its high porosity level (77%), sample #1 exhibits higher thermal conductivity than sample #3 (64% porosity) in both air and vacuum conditions, potentially due to the extra structural bonding provided by LiBr/LiCl. The observed difference in cross-plane thermal conductivity between air and vacuum conditions provides insights into the configuration of the anode's active material in the heat transfer direction. The lower limit corresponds to the parallel thermal circuit configuration of active material and air, which is the product of the sample's porosity and thermal conductivity of air. Our analysis suggests that in sample #2, the anode's active material and air inside the pores demonstrate a more serial configuration, while in sample #3, they exhibit a more parallel configuration in the heat transfer direction. However, the thermal conductivity difference observed for sample #1 falls below the theoretical lower bound indicating significant thermal radiation within the pores. Furthermore, the in-plane thermal conductivity is predominantly controlled by the copper foil. Sample #2 exhibits the lowest in-plane thermal conductivity. This is attributed to the severe oxidization of the copper foil by LiBr/LiCl, which is confirmed by structure characterization.
ISSN:0021-8979
1089-7550
DOI:10.1063/5.0189753