Improved customer satisfaction with a hybrid dispatching rule in semiconductor back-end factories

On-time delivery is a vital factor for customer satisfaction in the competitive semiconductor manufacturing industry, and to optimize on-time delivery manufacturers must continuously improve their management of work-in-progress (WIP). However, in undertaking to optimize WIP, managers are also concer...

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Bibliographic Details
Published in:International journal of production research 2008-09, Vol.46 (17), p.4903-4923
Main Authors: Chiang, David M., Guo, Ruey-Shan, Pai, Fan-Yun
Format: Article
Language:English
Subjects:
Applied sciences
Customer satisfaction
Decision theory. Utility theory
Dispatching
Exact sciences and technology
Fuzzy analytic hierarchy process
Fuzzy logic
Hierarchies
Inventory control, production control. Distribution
Manufacturing
Operational research and scientific management
Operational research. Management science
Semiconductor manufacturing
Semiconductors
Simulation
Studies
WIP balance
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Summary:On-time delivery is a vital factor for customer satisfaction in the competitive semiconductor manufacturing industry, and to optimize on-time delivery manufacturers must continuously improve their management of work-in-progress (WIP). However, in undertaking to optimize WIP, managers are also concerned with short cycle times, high throughput, and high utilization. In an attempt to find the most satisfactory solution to these potentially conflicting requirements with regard to WIP, the present study employs fuzzy analytic hierarchy process (AHP) to determine an appropriate set of acceptable WIP deviation levels (AWDLs). These AWDLs are then used in a proposed hybrid dispatching rule to determine the operational priorities of jobs. A simulation model using real-world data is then constructed to examine the proposed mechanism for improving customer satisfaction. The findings of the study confirm that the proposed mechanism is capable of simultaneous consideration of various goals and the achievement of enhanced performances with respect to due-date delivery from semiconductor back-end processes.
ISSN:0020-7543
1366-588X
DOI:10.1080/00207540701324168