Resonance ultrasonic vibration diagnostics of elastic stress in full-size silicon wafers

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Bibliographic Details
Published in:Semiconductor science and technology 2006-03, Vol.21 (3), p.254-260
Main Authors: Belyaev, A, Polupan, O, Ostapenko, S, Hess, D, Kalejs, J P
Format: Article
Language:English
Subjects:
Condensed matter: structure, mechanical and thermal properties
Cross-disciplinary physics: materials science
rheology
Elasticity, elastic constants
Exact sciences and technology
Materials science
Materials testing
Mechanical and acoustical properties of condensed matter
Mechanical properties of solids
Physics
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ISSN:0268-1242
1361-6641
DOI:10.1088/0268-1242/21/3/007