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A high-efficiency power and data transmission system for biomedical implanted electronic devices
In biomedical engineering, inductive transcutaneous links can be used for power and data transfer between external systems and implanted electronic devices. The development of a micro-telemeter having a significant implantation depth needs a high-efficiency magnetic transcutaneous link. This paper p...
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Published in: | Measurement science & technology 1996-02, Vol.7 (2), p.192-201 |
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Main Authors: | , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | In biomedical engineering, inductive transcutaneous links can be used for power and data transfer between external systems and implanted electronic devices. The development of a micro-telemeter having a significant implantation depth needs a high-efficiency magnetic transcutaneous link. This paper presents a new system, which uses a multi-frequency load network for transmitter coil based on the class E power amplifier. At the carrier frequency used, the resistive load is influenced by the coupling of the coils and by the variation of the implant equivalent resistance. Modulating this latter between two rails permits one to modulate the amplitude of the external transmitter current and then to transmit internal data without the use of the classical implanted emitter design. Furthermore, the fact that the modulation index depends on the coupling factor, allows one to find the external coil's correct position using a position feedback loop. A complete study of the concept of digital data transmission by impedance modulation associated with a class E power amplifier is presented. Internal data transmission using this system yields a decrease of the internal electronic circuitry bulk and constitutes a high-efficiency energizing device. A theoretical investigation shows that the efficiency of the power transfer varies between 44 and 75% within a wide range of implantation depths (20-40 mm). |
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ISSN: | 0957-0233 1361-6501 |
DOI: | 10.1088/0957-0233/7/2/012 |