Three-dimensional miniaturized power inductors realized in a batch-type hybrid technology

We present a new hybrid technology for the realization of three-dimensional millimetre-size inductors for low-power (0.1-1 W) applications. Our devices consist of electroplated planar Cu coils, realized within a high-resolution (5 *mm) polyimide flex-foil process, and mm-size ferrite magnetic cores,...

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Bibliographic Details
Published in:Journal of micromechanics and microengineering 2002-07, Vol.12 (4), p.470-474, Article 321
Main Authors: Saidani, Menouer, Gijs, Martin A M
Format: Article
Language:English
Subjects:
Applied sciences
Copper
Electric coils
Electrical engineering. Electrical power engineering
Electroplating
Exact sciences and technology
Ferrites
Hybrid integrated circuits
Inductance
Magnetic cores
Polyimides
Power electronics
Power electronics, power supplies
Power electronics
power supply circuits
Semiconductor device manufacture
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Summary:We present a new hybrid technology for the realization of three-dimensional millimetre-size inductors for low-power (0.1-1 W) applications. Our devices consist of electroplated planar Cu coils, realized within a high-resolution (5 *mm) polyimide flex-foil process, and mm-size ferrite magnetic cores, obtained by three-dimensional micropatterning of ferrite wafers using powder blasting microerosion. Our devices range in volume between 10 and 1.5 mm3 and we characterize their inductive and resistive properties as a function of frequency.
ISSN:0960-1317
1361-6439
DOI:10.1088/0960-1317/12/4/321