Spray coating of photoresist for pattern transfer on high topography surfaces

In this paper, a new method of photoresist coating, direct spray coating, is studied. This method is especially suited to coat high topography surfaces for some special applications in microelectromechanical systems, radio frequency components and packaging. The most suitable photoresist type and co...

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Bibliographic Details
Published in:Journal of micromechanics and microengineering 2005-04, Vol.15 (4), p.691-697
Main Authors: Pham, Nga P, Burghartz, Joachim N, Sarro, Pasqualina M
Format: Article
Language:English
Subjects:
Applied sciences
Electronics
Exact sciences and technology
Instruments, apparatus, components and techniques common to several branches of physics and astronomy
Mechanical engineering. Machine design
Mechanical instruments, equipment and techniques
Microelectronic fabrication (materials and surfaces technology)
Micromechanical devices and systems
Physics
Precision engineering, watch making
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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Summary:In this paper, a new method of photoresist coating, direct spray coating, is studied. This method is especially suited to coat high topography surfaces for some special applications in microelectromechanical systems, radio frequency components and packaging. The most suitable photoresist type and coating process are found. The influence of several coating parameters on the thickness and uniformity of the photoresist layer is investigated. A model describing the dependence of the thickness on the major parameters is presented. Very promising results are obtained using spray coating for the fabrication of several three-dimensional structures.
ISSN:0960-1317
1361-6439
DOI:10.1088/0960-1317/15/4/003