Ultrasonic vibration-assisted femtosecond laser machining of microholes

In this note, we describe a novel approach to improving laser hole drilling quality by exciting the work material with a high frequency ultrasonic vibrator during a femtosecond laser drilling process. It is found that both the aspect ratio (depth over diameter) and the wall surface finish of the mic...

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Bibliographic Details
Published in:Journal of micromechanics and microengineering 2007-08, Vol.17 (8), p.N58-N61
Main Authors: Zheng, H Y, Huang, H
Format: Article
Language:English
Subjects:
Applied sciences
Electronics
Exact sciences and technology
Instruments, apparatus, components and techniques common to several branches of physics and astronomy
Mechanical engineering. Machine design
Mechanical instruments, equipment and techniques
Microelectronic fabrication (materials and surfaces technology)
Micromechanical devices and systems
Physics
Precision engineering, watch making
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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Summary:In this note, we describe a novel approach to improving laser hole drilling quality by exciting the work material with a high frequency ultrasonic vibrator during a femtosecond laser drilling process. It is found that both the aspect ratio (depth over diameter) and the wall surface finish of the microholes fabricated using the ultrasonic vibration (US) assisted laser drilling are improved, compared to those laser machined without US assistance. This is because the introduction of US into the femtosecond laser drilling process reduced the resolidified and redeposited particles on the wall surfaces.
ISSN:0960-1317
1361-6439
DOI:10.1088/0960-1317/17/8/N03