Vapor etching to avoid micro-masking by gas-bubbles in wet release of MEMS

We report on the formation of gas bubbles during the release of MEMS devices using buffered oxide etch. Several approaches to mitigate the problem are proposed and tested together with a qualitative study of the phenomenon. The chemical reaction behind such phenomenon and the influence of defects an...

Full description

Saved in:
Bibliographic Details
Published in:Journal of micromechanics and microengineering 2023-07, Vol.33 (7), p.77001
Main Authors: Plaza, Alejandro, Maspero, Federico, Cuccurullo, Simone, Pavese, Giulia, Avila, Miguel Angel Badillo, Bertacco, Riccardo
Format: Article
Language:English
Subjects:
bubbles
MEMS
micro-masking
wet etching
Citations: Items that this one cites
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:We report on the formation of gas bubbles during the release of MEMS devices using buffered oxide etch. Several approaches to mitigate the problem are proposed and tested together with a qualitative study of the phenomenon. The chemical reaction behind such phenomenon and the influence of defects and topography is discussed. Finally, a comparison with the HF-vapor release technique is shown.
ISSN:0960-1317
1361-6439
DOI:10.1088/1361-6439/acd25d