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Impact of process-induced ellipticity on the RESET process of cylindrical phase change memory devices
Phase change memory (PCM) is one of the promising candidates for the next-generation high-speed non-volatile memory which exhibits excellent scalability. The cylindrical-type PCM devices entering the nano-scale regime should show their tolerance to the variation in the manufacturing process. However...
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Published in: | Physica scripta 2022-12, Vol.97 (12), p.125005 |
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Main Authors: | , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites |
Online Access: | Get full text |
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Summary: | Phase change memory (PCM) is one of the promising candidates for the next-generation high-speed non-volatile memory which exhibits excellent scalability. The cylindrical-type PCM devices entering the nano-scale regime should show their tolerance to the variation in the manufacturing process. However, it is highly challenging to fabricate cylindrical-type nano-scale devices ideally with circular cross-sections. In general, the degree of variation in circular cross-section is dictated by a geometrical parameter called aspect ratio (AR). In this study, the impact of variation in AR of heater (AR
heater
) and active material, Ge
2
Sb
2
Te
5
(AR
GST
) on the RESET programming of the mushroom-type cylindrical PCM device is systematically investigated by using 3D TCAD simulations. The simulation results reveal that the RESET current (I
RESET
) of the reference device (100 nm heater diameter) consisting of elliptical cross-sections increases significantly to ∼67% when AR
heater
= 2 and 1 ≤ AR
GST
≤ 2, whereas for the scaled-down devices of 20 nm and 10 nm heater diameter with elliptical cross-sections, the I
RESET
increases to ∼35% and ∼38% when AR
heater
= 2 and AR
GST
= 1, and further I
RESET
increases to ∼54% and ∼63% when AR
heater
= 2 and AR
GST
= 2 leading to high-power RESET programming. In the case of the reference device, the AR
GST
did not play any significant role on I
RESET
. However, in the scaled-down devices, both AR
heater
and AR
GST
significantly affect the I
RESET
. Furthermore, the device employing a vertically-oriented elliptical heater and horizontally-oriented elliptical GST (where AR
heater
= 2 and AR
GST
= 0.5) shows the peculiar re-amorphization among all the cases considered in this study. Hence, the miniaturized cylindrical PCM devices comprising elliptical cross-sections due to process-induced variability require an accurate understanding of the programming characteristics for reliable modeling and simulations. |
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ISSN: | 0031-8949 1402-4896 |
DOI: | 10.1088/1402-4896/ac9dcd |