Sintering of copper nanoparticles using intense pulsed light for screen-printed films on flexible substrate

Rapid growth in applications involving large area flexible electronics has led to wide adoption of the technique of sintering printed films using intense pulsed light (IPL) due to its pulse mode operation and ability to reach high sintering temperatures without affecting the underlying substrate sig...

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Bibliographic Details
Published in:Flexible and printed electronics 2024-12, Vol.9 (4)
Main Authors: Manoranjan, Gupta, Ashish, Mohapatra, Y N
Format: Article
Language:English
Subjects:
copper nanoparticles
IPL sintering
mechanism
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Summary:Rapid growth in applications involving large area flexible electronics has led to wide adoption of the technique of sintering printed films using intense pulsed light (IPL) due to its pulse mode operation and ability to reach high sintering temperatures without affecting the underlying substrate significantly. We study sintering mechanisms of screen-printed thin films of copper nanoparticles on polyethylene terephthalate (PET) plastic substrate by varying irradiance energy over a wide range to monitor conductivity and associated microstructure changes. We obtain optimized parameters which indicate existence of a sharp threshold irradiance energy to kickstart sintering, and two distinct regimes beyond that. The low temperature regime has a high energy barrier while the high temperature regime has a substantially reduced energy barrier with change of phase due to local melting.
ISSN:2058-8585
2058-8585
DOI:10.1088/2058-8585/ad8934