A direct-writing approach to the micro-patterning of copper onto polyimide

Purpose - The purpose of this paper is to present a novel manufacturing process that aims to pattern metal tracks onto polyimide at atmospheric pressure and ambient environment. The process can be scaled up for industrial applications.Design methodology approach - From a thorough literature survey,...

Full description

Saved in:
Bibliographic Details
Published in:Circuit world 2009-05, Vol.35 (2), p.3-17
Main Authors: Ng, J.H.-G., Desmulliez, M.P.Y., Lamponi, M., Moffat, B.G., McCarthy, A., Suyal, H., Walker, A.C., Prior, K.A., Hand, D.P.
Format: Article
Language:English
Subjects:
Copper
Electrolytes
Heat
Integrated circuits
Lasers
Nanoparticles
Plating
Polymers
Production methods
Studies
Thin films
Writing
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Purpose - The purpose of this paper is to present a novel manufacturing process that aims to pattern metal tracks onto polyimide at atmospheric pressure and ambient environment. The process can be scaled up for industrial applications.Design methodology approach - From a thorough literature survey, different approaches were carried out for processing polyimide. Following a design of experiments for the processing and various characterisation techniques, a micro-coil was manufactured as a test demonstrator.Findings - The characteristics of some main formaldehyde-based electroless copper baths were compared. The quality of the sidewalls was characterised and the performance of the process was assessed.Originality value - This paper demonstrates a high-value manufacturing technique that is mass manufacturable, low cost and suitable for use on 3D surfaces. Criteria required for the development of a direct-writing process have been described. The issues surrounding electroless plating on polyimide have been explained.
ISSN:0305-6120
1758-602X
DOI:10.1108/03056120910953268