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Reactance components embedded in printed circuit boards
Purpose – This paper aims to report the investigations of capacitors and inductors embedded into printed circuit boards (PCBs) designed in various layouts. Design/methodology/approach – The research were focused on the components embedded into four-layer PCBs with different structures of the inner l...
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Published in: | Circuit world 2015-08, Vol.41 (3), p.125-132 |
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container_end_page | 132 |
container_issue | 3 |
container_start_page | 125 |
container_title | Circuit world |
container_volume | 41 |
creator | Stęplewski, Wojciech Dziedzic, Andrzej Kłossowicz, Adam Winiarski, Paweł Borecki, Janusz Kozioł, Grażyna Serzysko, Tomasz |
description | Purpose
– This paper aims to report the investigations of capacitors and inductors embedded into printed circuit boards (PCBs) designed in various layouts.
Design/methodology/approach
– The research were focused on the components embedded into four-layer PCBs with different structures of the inner layers. Three special capacitive laminates for manufacturing of thin-film embedded capacitors and several types of coils in the form of a spiral, meander and solenoid are described. In addition, a part of the spiral-type coils was formed with an aperture in the center in which the magnetic core, made of soft magnetic composites’ material was placed to increase the coil inductance.
Findings
– Various constructions of embedded capacitors and coils were designed and manufactured. Capacitance and loss tangent of capacitors to determine the repeatability of the production process were determined. Capacitor’s long-term stability analysis was performed by exposing test samples to elevated temperatures (70, 100 or 130°C), realized with the aid of heating plate, for at least 160 h. The temperature characteristics for the capacitance and loss tangent from 15 to 100°C were determined. Also the induction of different designs and layouts coils was determined.
Originality/value
– The wide parameters’ characterization of capacitors and coils embedded into PCBs allow the analysis of their properties with regard to their practical application. The promising results of the realized measurements show that the capacitors and induction coils with studied structures can be widely used in the construction of embedded circuits into PCBs (e.g. filters, radio frequency identification systems and generators). |
doi_str_mv | 10.1108/CW-03-2015-0009 |
format | article |
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– This paper aims to report the investigations of capacitors and inductors embedded into printed circuit boards (PCBs) designed in various layouts.
Design/methodology/approach
– The research were focused on the components embedded into four-layer PCBs with different structures of the inner layers. Three special capacitive laminates for manufacturing of thin-film embedded capacitors and several types of coils in the form of a spiral, meander and solenoid are described. In addition, a part of the spiral-type coils was formed with an aperture in the center in which the magnetic core, made of soft magnetic composites’ material was placed to increase the coil inductance.
Findings
– Various constructions of embedded capacitors and coils were designed and manufactured. Capacitance and loss tangent of capacitors to determine the repeatability of the production process were determined. Capacitor’s long-term stability analysis was performed by exposing test samples to elevated temperatures (70, 100 or 130°C), realized with the aid of heating plate, for at least 160 h. The temperature characteristics for the capacitance and loss tangent from 15 to 100°C were determined. Also the induction of different designs and layouts coils was determined.
Originality/value
– The wide parameters’ characterization of capacitors and coils embedded into PCBs allow the analysis of their properties with regard to their practical application. The promising results of the realized measurements show that the capacitors and induction coils with studied structures can be widely used in the construction of embedded circuits into PCBs (e.g. filters, radio frequency identification systems and generators).</description><identifier>ISSN: 0305-6120</identifier><identifier>EISSN: 1758-602X</identifier><identifier>DOI: 10.1108/CW-03-2015-0009</identifier><language>eng</language><publisher>Bradford: Emerald Group Publishing Limited</publisher><subject>Aperture ; Boards ; Capacitance ; Capacitors ; Circuit boards ; Circuit design ; Circuits ; Coiling ; Coils ; Construction ; Copper ; Design ; Electrical & electronic engineering ; Electrodes ; Embedded structures ; Embedded systems ; Engineering ; High temperature ; Inductance ; Induction coils ; Inductors ; Laminates ; Layouts ; Plates (structural members) ; Printed circuits ; Radio frequency identification ; Reactance ; Stability analysis ; Standard deviation ; Tangents ; Temperature ; Thin films</subject><ispartof>Circuit world, 2015-08, Vol.41 (3), p.125-132</ispartof><rights>Emerald Group Publishing Limited</rights><rights>Emerald Group Publishing Limited 2015</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c295t-80427e78a9fbebcb8ace7be2dc199fef103dd38b8a3a2beea4cc06e1b5c437c13</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.proquest.com/docview/2082166826?pq-origsite=primo$$EHTML$$P50$$Gproquest$$H</linktohtml><link.rule.ids>314,776,780,11667,27901,27902,36037,36038,44339</link.rule.ids></links><search><creatorcontrib>Stęplewski, Wojciech</creatorcontrib><creatorcontrib>Dziedzic, Andrzej</creatorcontrib><creatorcontrib>Kłossowicz, Adam</creatorcontrib><creatorcontrib>Winiarski, Paweł</creatorcontrib><creatorcontrib>Borecki, Janusz</creatorcontrib><creatorcontrib>Kozioł, Grażyna</creatorcontrib><creatorcontrib>Serzysko, Tomasz</creatorcontrib><title>Reactance components embedded in printed circuit boards</title><title>Circuit world</title><description>Purpose
– This paper aims to report the investigations of capacitors and inductors embedded into printed circuit boards (PCBs) designed in various layouts.
Design/methodology/approach
– The research were focused on the components embedded into four-layer PCBs with different structures of the inner layers. Three special capacitive laminates for manufacturing of thin-film embedded capacitors and several types of coils in the form of a spiral, meander and solenoid are described. In addition, a part of the spiral-type coils was formed with an aperture in the center in which the magnetic core, made of soft magnetic composites’ material was placed to increase the coil inductance.
Findings
– Various constructions of embedded capacitors and coils were designed and manufactured. Capacitance and loss tangent of capacitors to determine the repeatability of the production process were determined. Capacitor’s long-term stability analysis was performed by exposing test samples to elevated temperatures (70, 100 or 130°C), realized with the aid of heating plate, for at least 160 h. The temperature characteristics for the capacitance and loss tangent from 15 to 100°C were determined. Also the induction of different designs and layouts coils was determined.
Originality/value
– The wide parameters’ characterization of capacitors and coils embedded into PCBs allow the analysis of their properties with regard to their practical application. The promising results of the realized measurements show that the capacitors and induction coils with studied structures can be widely used in the construction of embedded circuits into PCBs (e.g. filters, radio frequency identification systems and generators).</description><subject>Aperture</subject><subject>Boards</subject><subject>Capacitance</subject><subject>Capacitors</subject><subject>Circuit boards</subject><subject>Circuit design</subject><subject>Circuits</subject><subject>Coiling</subject><subject>Coils</subject><subject>Construction</subject><subject>Copper</subject><subject>Design</subject><subject>Electrical & electronic engineering</subject><subject>Electrodes</subject><subject>Embedded structures</subject><subject>Embedded systems</subject><subject>Engineering</subject><subject>High temperature</subject><subject>Inductance</subject><subject>Induction coils</subject><subject>Inductors</subject><subject>Laminates</subject><subject>Layouts</subject><subject>Plates (structural members)</subject><subject>Printed circuits</subject><subject>Radio frequency identification</subject><subject>Reactance</subject><subject>Stability analysis</subject><subject>Standard deviation</subject><subject>Tangents</subject><subject>Temperature</subject><subject>Thin films</subject><issn>0305-6120</issn><issn>1758-602X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2015</creationdate><recordtype>article</recordtype><sourceid>M0C</sourceid><recordid>eNptkMtLxDAQh4MouK6evRa8eMnuJGmb9CjFFywIoqy3kMcUuvSxJu3B_94s60XxNMPw_YaZj5BrBivGQK3rLQVBObCCAkB1QhZMFoqWwD9OyQIEFLRkHM7JRYy7RIiCswWRr2jcZAaHmRv7_TjgMMUMe4veo8_aIduHdphS69rg5nbK7GiCj5fkrDFdxKufuiTvD_dv9RPdvDw-13cb6nhVTFRBziVKZarGonVWGYfSIveOVVWDDQPhvVBpLgy3iCZ3DkpktnC5kI6JJbk97t2H8XPGOOm-jQ67zgw4zlEzyVQlQRYyoTd_0N04hyFdpzkozspS8TJR6yPlwhhjwEanB3sTvjQDfRCp660GoQ8i9UFkSqyOCewxmM7_E_hlXnwDZ7lzmA</recordid><startdate>20150803</startdate><enddate>20150803</enddate><creator>Stęplewski, Wojciech</creator><creator>Dziedzic, Andrzej</creator><creator>Kłossowicz, Adam</creator><creator>Winiarski, Paweł</creator><creator>Borecki, Janusz</creator><creator>Kozioł, Grażyna</creator><creator>Serzysko, Tomasz</creator><general>Emerald Group Publishing 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components embedded in printed circuit boards</title><author>Stęplewski, Wojciech ; Dziedzic, Andrzej ; Kłossowicz, Adam ; Winiarski, Paweł ; Borecki, Janusz ; Kozioł, Grażyna ; Serzysko, Tomasz</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c295t-80427e78a9fbebcb8ace7be2dc199fef103dd38b8a3a2beea4cc06e1b5c437c13</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2015</creationdate><topic>Aperture</topic><topic>Boards</topic><topic>Capacitance</topic><topic>Capacitors</topic><topic>Circuit boards</topic><topic>Circuit design</topic><topic>Circuits</topic><topic>Coiling</topic><topic>Coils</topic><topic>Construction</topic><topic>Copper</topic><topic>Design</topic><topic>Electrical & electronic engineering</topic><topic>Electrodes</topic><topic>Embedded structures</topic><topic>Embedded systems</topic><topic>Engineering</topic><topic>High temperature</topic><topic>Inductance</topic><topic>Induction coils</topic><topic>Inductors</topic><topic>Laminates</topic><topic>Layouts</topic><topic>Plates (structural members)</topic><topic>Printed circuits</topic><topic>Radio frequency identification</topic><topic>Reactance</topic><topic>Stability analysis</topic><topic>Standard deviation</topic><topic>Tangents</topic><topic>Temperature</topic><topic>Thin films</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Stęplewski, Wojciech</creatorcontrib><creatorcontrib>Dziedzic, Andrzej</creatorcontrib><creatorcontrib>Kłossowicz, Adam</creatorcontrib><creatorcontrib>Winiarski, Paweł</creatorcontrib><creatorcontrib>Borecki, Janusz</creatorcontrib><creatorcontrib>Kozioł, Grażyna</creatorcontrib><creatorcontrib>Serzysko, Tomasz</creatorcontrib><collection>CrossRef</collection><collection>Global News & ABI/Inform Professional</collection><collection>Trade PRO</collection><collection>Electronics & Communications Abstracts</collection><collection>Materials 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boards</atitle><jtitle>Circuit world</jtitle><date>2015-08-03</date><risdate>2015</risdate><volume>41</volume><issue>3</issue><spage>125</spage><epage>132</epage><pages>125-132</pages><issn>0305-6120</issn><eissn>1758-602X</eissn><abstract>Purpose
– This paper aims to report the investigations of capacitors and inductors embedded into printed circuit boards (PCBs) designed in various layouts.
Design/methodology/approach
– The research were focused on the components embedded into four-layer PCBs with different structures of the inner layers. Three special capacitive laminates for manufacturing of thin-film embedded capacitors and several types of coils in the form of a spiral, meander and solenoid are described. In addition, a part of the spiral-type coils was formed with an aperture in the center in which the magnetic core, made of soft magnetic composites’ material was placed to increase the coil inductance.
Findings
– Various constructions of embedded capacitors and coils were designed and manufactured. Capacitance and loss tangent of capacitors to determine the repeatability of the production process were determined. Capacitor’s long-term stability analysis was performed by exposing test samples to elevated temperatures (70, 100 or 130°C), realized with the aid of heating plate, for at least 160 h. The temperature characteristics for the capacitance and loss tangent from 15 to 100°C were determined. Also the induction of different designs and layouts coils was determined.
Originality/value
– The wide parameters’ characterization of capacitors and coils embedded into PCBs allow the analysis of their properties with regard to their practical application. The promising results of the realized measurements show that the capacitors and induction coils with studied structures can be widely used in the construction of embedded circuits into PCBs (e.g. filters, radio frequency identification systems and generators).</abstract><cop>Bradford</cop><pub>Emerald Group Publishing Limited</pub><doi>10.1108/CW-03-2015-0009</doi><tpages>8</tpages></addata></record> |
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source | ABI/INFORM global; Emerald:Jisc Collections:Emerald Subject Collections HE and FE 2024-2026:Emerald Premier (reading list) |
subjects | Aperture Boards Capacitance Capacitors Circuit boards Circuit design Circuits Coiling Coils Construction Copper Design Electrical & electronic engineering Electrodes Embedded structures Embedded systems Engineering High temperature Inductance Induction coils Inductors Laminates Layouts Plates (structural members) Printed circuits Radio frequency identification Reactance Stability analysis Standard deviation Tangents Temperature Thin films |
title | Reactance components embedded in printed circuit boards |
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