Loading…

Reactance components embedded in printed circuit boards

Purpose – This paper aims to report the investigations of capacitors and inductors embedded into printed circuit boards (PCBs) designed in various layouts. Design/methodology/approach – The research were focused on the components embedded into four-layer PCBs with different structures of the inner l...

Full description

Saved in:
Bibliographic Details
Published in:Circuit world 2015-08, Vol.41 (3), p.125-132
Main Authors: Stęplewski, Wojciech, Dziedzic, Andrzej, Kłossowicz, Adam, Winiarski, Paweł, Borecki, Janusz, Kozioł, Grażyna, Serzysko, Tomasz
Format: Article
Language:English
Subjects:
Citations: Items that this one cites
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
cited_by
cites cdi_FETCH-LOGICAL-c295t-80427e78a9fbebcb8ace7be2dc199fef103dd38b8a3a2beea4cc06e1b5c437c13
container_end_page 132
container_issue 3
container_start_page 125
container_title Circuit world
container_volume 41
creator Stęplewski, Wojciech
Dziedzic, Andrzej
Kłossowicz, Adam
Winiarski, Paweł
Borecki, Janusz
Kozioł, Grażyna
Serzysko, Tomasz
description Purpose – This paper aims to report the investigations of capacitors and inductors embedded into printed circuit boards (PCBs) designed in various layouts. Design/methodology/approach – The research were focused on the components embedded into four-layer PCBs with different structures of the inner layers. Three special capacitive laminates for manufacturing of thin-film embedded capacitors and several types of coils in the form of a spiral, meander and solenoid are described. In addition, a part of the spiral-type coils was formed with an aperture in the center in which the magnetic core, made of soft magnetic composites’ material was placed to increase the coil inductance. Findings – Various constructions of embedded capacitors and coils were designed and manufactured. Capacitance and loss tangent of capacitors to determine the repeatability of the production process were determined. Capacitor’s long-term stability analysis was performed by exposing test samples to elevated temperatures (70, 100 or 130°C), realized with the aid of heating plate, for at least 160 h. The temperature characteristics for the capacitance and loss tangent from 15 to 100°C were determined. Also the induction of different designs and layouts coils was determined. Originality/value – The wide parameters’ characterization of capacitors and coils embedded into PCBs allow the analysis of their properties with regard to their practical application. The promising results of the realized measurements show that the capacitors and induction coils with studied structures can be widely used in the construction of embedded circuits into PCBs (e.g. filters, radio frequency identification systems and generators).
doi_str_mv 10.1108/CW-03-2015-0009
format article
fullrecord <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_crossref_primary_10_1108_CW_03_2015_0009</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2082166826</sourcerecordid><originalsourceid>FETCH-LOGICAL-c295t-80427e78a9fbebcb8ace7be2dc199fef103dd38b8a3a2beea4cc06e1b5c437c13</originalsourceid><addsrcrecordid>eNptkMtLxDAQh4MouK6evRa8eMnuJGmb9CjFFywIoqy3kMcUuvSxJu3B_94s60XxNMPw_YaZj5BrBivGQK3rLQVBObCCAkB1QhZMFoqWwD9OyQIEFLRkHM7JRYy7RIiCswWRr2jcZAaHmRv7_TjgMMUMe4veo8_aIduHdphS69rg5nbK7GiCj5fkrDFdxKufuiTvD_dv9RPdvDw-13cb6nhVTFRBziVKZarGonVWGYfSIveOVVWDDQPhvVBpLgy3iCZ3DkpktnC5kI6JJbk97t2H8XPGOOm-jQ67zgw4zlEzyVQlQRYyoTd_0N04hyFdpzkozspS8TJR6yPlwhhjwEanB3sTvjQDfRCp660GoQ8i9UFkSqyOCewxmM7_E_hlXnwDZ7lzmA</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2082166826</pqid></control><display><type>article</type><title>Reactance components embedded in printed circuit boards</title><source>ABI/INFORM global</source><source>Emerald:Jisc Collections:Emerald Subject Collections HE and FE 2024-2026:Emerald Premier (reading list)</source><creator>Stęplewski, Wojciech ; Dziedzic, Andrzej ; Kłossowicz, Adam ; Winiarski, Paweł ; Borecki, Janusz ; Kozioł, Grażyna ; Serzysko, Tomasz</creator><creatorcontrib>Stęplewski, Wojciech ; Dziedzic, Andrzej ; Kłossowicz, Adam ; Winiarski, Paweł ; Borecki, Janusz ; Kozioł, Grażyna ; Serzysko, Tomasz</creatorcontrib><description>Purpose – This paper aims to report the investigations of capacitors and inductors embedded into printed circuit boards (PCBs) designed in various layouts. Design/methodology/approach – The research were focused on the components embedded into four-layer PCBs with different structures of the inner layers. Three special capacitive laminates for manufacturing of thin-film embedded capacitors and several types of coils in the form of a spiral, meander and solenoid are described. In addition, a part of the spiral-type coils was formed with an aperture in the center in which the magnetic core, made of soft magnetic composites’ material was placed to increase the coil inductance. Findings – Various constructions of embedded capacitors and coils were designed and manufactured. Capacitance and loss tangent of capacitors to determine the repeatability of the production process were determined. Capacitor’s long-term stability analysis was performed by exposing test samples to elevated temperatures (70, 100 or 130°C), realized with the aid of heating plate, for at least 160 h. The temperature characteristics for the capacitance and loss tangent from 15 to 100°C were determined. Also the induction of different designs and layouts coils was determined. Originality/value – The wide parameters’ characterization of capacitors and coils embedded into PCBs allow the analysis of their properties with regard to their practical application. The promising results of the realized measurements show that the capacitors and induction coils with studied structures can be widely used in the construction of embedded circuits into PCBs (e.g. filters, radio frequency identification systems and generators).</description><identifier>ISSN: 0305-6120</identifier><identifier>EISSN: 1758-602X</identifier><identifier>DOI: 10.1108/CW-03-2015-0009</identifier><language>eng</language><publisher>Bradford: Emerald Group Publishing Limited</publisher><subject>Aperture ; Boards ; Capacitance ; Capacitors ; Circuit boards ; Circuit design ; Circuits ; Coiling ; Coils ; Construction ; Copper ; Design ; Electrical &amp; electronic engineering ; Electrodes ; Embedded structures ; Embedded systems ; Engineering ; High temperature ; Inductance ; Induction coils ; Inductors ; Laminates ; Layouts ; Plates (structural members) ; Printed circuits ; Radio frequency identification ; Reactance ; Stability analysis ; Standard deviation ; Tangents ; Temperature ; Thin films</subject><ispartof>Circuit world, 2015-08, Vol.41 (3), p.125-132</ispartof><rights>Emerald Group Publishing Limited</rights><rights>Emerald Group Publishing Limited 2015</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c295t-80427e78a9fbebcb8ace7be2dc199fef103dd38b8a3a2beea4cc06e1b5c437c13</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.proquest.com/docview/2082166826?pq-origsite=primo$$EHTML$$P50$$Gproquest$$H</linktohtml><link.rule.ids>314,776,780,11667,27901,27902,36037,36038,44339</link.rule.ids></links><search><creatorcontrib>Stęplewski, Wojciech</creatorcontrib><creatorcontrib>Dziedzic, Andrzej</creatorcontrib><creatorcontrib>Kłossowicz, Adam</creatorcontrib><creatorcontrib>Winiarski, Paweł</creatorcontrib><creatorcontrib>Borecki, Janusz</creatorcontrib><creatorcontrib>Kozioł, Grażyna</creatorcontrib><creatorcontrib>Serzysko, Tomasz</creatorcontrib><title>Reactance components embedded in printed circuit boards</title><title>Circuit world</title><description>Purpose – This paper aims to report the investigations of capacitors and inductors embedded into printed circuit boards (PCBs) designed in various layouts. Design/methodology/approach – The research were focused on the components embedded into four-layer PCBs with different structures of the inner layers. Three special capacitive laminates for manufacturing of thin-film embedded capacitors and several types of coils in the form of a spiral, meander and solenoid are described. In addition, a part of the spiral-type coils was formed with an aperture in the center in which the magnetic core, made of soft magnetic composites’ material was placed to increase the coil inductance. Findings – Various constructions of embedded capacitors and coils were designed and manufactured. Capacitance and loss tangent of capacitors to determine the repeatability of the production process were determined. Capacitor’s long-term stability analysis was performed by exposing test samples to elevated temperatures (70, 100 or 130°C), realized with the aid of heating plate, for at least 160 h. The temperature characteristics for the capacitance and loss tangent from 15 to 100°C were determined. Also the induction of different designs and layouts coils was determined. Originality/value – The wide parameters’ characterization of capacitors and coils embedded into PCBs allow the analysis of their properties with regard to their practical application. The promising results of the realized measurements show that the capacitors and induction coils with studied structures can be widely used in the construction of embedded circuits into PCBs (e.g. filters, radio frequency identification systems and generators).</description><subject>Aperture</subject><subject>Boards</subject><subject>Capacitance</subject><subject>Capacitors</subject><subject>Circuit boards</subject><subject>Circuit design</subject><subject>Circuits</subject><subject>Coiling</subject><subject>Coils</subject><subject>Construction</subject><subject>Copper</subject><subject>Design</subject><subject>Electrical &amp; electronic engineering</subject><subject>Electrodes</subject><subject>Embedded structures</subject><subject>Embedded systems</subject><subject>Engineering</subject><subject>High temperature</subject><subject>Inductance</subject><subject>Induction coils</subject><subject>Inductors</subject><subject>Laminates</subject><subject>Layouts</subject><subject>Plates (structural members)</subject><subject>Printed circuits</subject><subject>Radio frequency identification</subject><subject>Reactance</subject><subject>Stability analysis</subject><subject>Standard deviation</subject><subject>Tangents</subject><subject>Temperature</subject><subject>Thin films</subject><issn>0305-6120</issn><issn>1758-602X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2015</creationdate><recordtype>article</recordtype><sourceid>M0C</sourceid><recordid>eNptkMtLxDAQh4MouK6evRa8eMnuJGmb9CjFFywIoqy3kMcUuvSxJu3B_94s60XxNMPw_YaZj5BrBivGQK3rLQVBObCCAkB1QhZMFoqWwD9OyQIEFLRkHM7JRYy7RIiCswWRr2jcZAaHmRv7_TjgMMUMe4veo8_aIduHdphS69rg5nbK7GiCj5fkrDFdxKufuiTvD_dv9RPdvDw-13cb6nhVTFRBziVKZarGonVWGYfSIveOVVWDDQPhvVBpLgy3iCZ3DkpktnC5kI6JJbk97t2H8XPGOOm-jQ67zgw4zlEzyVQlQRYyoTd_0N04hyFdpzkozspS8TJR6yPlwhhjwEanB3sTvjQDfRCp660GoQ8i9UFkSqyOCewxmM7_E_hlXnwDZ7lzmA</recordid><startdate>20150803</startdate><enddate>20150803</enddate><creator>Stęplewski, Wojciech</creator><creator>Dziedzic, Andrzej</creator><creator>Kłossowicz, Adam</creator><creator>Winiarski, Paweł</creator><creator>Borecki, Janusz</creator><creator>Kozioł, Grażyna</creator><creator>Serzysko, Tomasz</creator><general>Emerald Group Publishing Limited</general><scope>AAYXX</scope><scope>CITATION</scope><scope>0U~</scope><scope>1-H</scope><scope>7SP</scope><scope>7TA</scope><scope>7WY</scope><scope>7WZ</scope><scope>7XB</scope><scope>8AO</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BEZIV</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>DWQXO</scope><scope>F28</scope><scope>FR3</scope><scope>F~G</scope><scope>GNUQQ</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>K6~</scope><scope>L.-</scope><scope>L.0</scope><scope>L7M</scope><scope>M0C</scope><scope>M2P</scope><scope>P5Z</scope><scope>P62</scope><scope>PHGZM</scope><scope>PHGZT</scope><scope>PKEHL</scope><scope>PQBIZ</scope><scope>PQEST</scope><scope>PQGLB</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>Q9U</scope><scope>S0W</scope><scope>7SC</scope><scope>JQ2</scope><scope>L~C</scope><scope>L~D</scope></search><sort><creationdate>20150803</creationdate><title>Reactance components embedded in printed circuit boards</title><author>Stęplewski, Wojciech ; Dziedzic, Andrzej ; Kłossowicz, Adam ; Winiarski, Paweł ; Borecki, Janusz ; Kozioł, Grażyna ; Serzysko, Tomasz</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c295t-80427e78a9fbebcb8ace7be2dc199fef103dd38b8a3a2beea4cc06e1b5c437c13</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2015</creationdate><topic>Aperture</topic><topic>Boards</topic><topic>Capacitance</topic><topic>Capacitors</topic><topic>Circuit boards</topic><topic>Circuit design</topic><topic>Circuits</topic><topic>Coiling</topic><topic>Coils</topic><topic>Construction</topic><topic>Copper</topic><topic>Design</topic><topic>Electrical &amp; electronic engineering</topic><topic>Electrodes</topic><topic>Embedded structures</topic><topic>Embedded systems</topic><topic>Engineering</topic><topic>High temperature</topic><topic>Inductance</topic><topic>Induction coils</topic><topic>Inductors</topic><topic>Laminates</topic><topic>Layouts</topic><topic>Plates (structural members)</topic><topic>Printed circuits</topic><topic>Radio frequency identification</topic><topic>Reactance</topic><topic>Stability analysis</topic><topic>Standard deviation</topic><topic>Tangents</topic><topic>Temperature</topic><topic>Thin films</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Stęplewski, Wojciech</creatorcontrib><creatorcontrib>Dziedzic, Andrzej</creatorcontrib><creatorcontrib>Kłossowicz, Adam</creatorcontrib><creatorcontrib>Winiarski, Paweł</creatorcontrib><creatorcontrib>Borecki, Janusz</creatorcontrib><creatorcontrib>Kozioł, Grażyna</creatorcontrib><creatorcontrib>Serzysko, Tomasz</creatorcontrib><collection>CrossRef</collection><collection>Global News &amp; ABI/Inform Professional</collection><collection>Trade PRO</collection><collection>Electronics &amp; Communications Abstracts</collection><collection>Materials Business File</collection><collection>ABI商业信息数据库</collection><collection>ABI/INFORM Global (PDF only)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>ProQuest Pharma Collection</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies &amp; Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>AUTh Library subscriptions: ProQuest Central</collection><collection>ProQuest Business Premium Collection</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Central</collection><collection>ANTE: Abstracts in New Technology &amp; Engineering</collection><collection>Engineering Research Database</collection><collection>ABI/INFORM Global (Corporate)</collection><collection>ProQuest Central Student</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>ProQuest Business Collection</collection><collection>ABI/INFORM Professional Advanced</collection><collection>ABI/INFORM Professional Standard</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ABI/INFORM global</collection><collection>Science Database (ProQuest)</collection><collection>ProQuest advanced technologies &amp; aerospace journals</collection><collection>ProQuest Advanced Technologies &amp; Aerospace Collection</collection><collection>ProQuest Central (New)</collection><collection>ProQuest One Academic (New)</collection><collection>ProQuest One Academic Middle East (New)</collection><collection>One Business (ProQuest)</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Applied &amp; Life Sciences</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central Basic</collection><collection>DELNET Engineering &amp; Technology Collection</collection><collection>Computer and Information Systems Abstracts</collection><collection>ProQuest Computer Science Collection</collection><collection>Computer and Information Systems Abstracts – Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><jtitle>Circuit world</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Stęplewski, Wojciech</au><au>Dziedzic, Andrzej</au><au>Kłossowicz, Adam</au><au>Winiarski, Paweł</au><au>Borecki, Janusz</au><au>Kozioł, Grażyna</au><au>Serzysko, Tomasz</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Reactance components embedded in printed circuit boards</atitle><jtitle>Circuit world</jtitle><date>2015-08-03</date><risdate>2015</risdate><volume>41</volume><issue>3</issue><spage>125</spage><epage>132</epage><pages>125-132</pages><issn>0305-6120</issn><eissn>1758-602X</eissn><abstract>Purpose – This paper aims to report the investigations of capacitors and inductors embedded into printed circuit boards (PCBs) designed in various layouts. Design/methodology/approach – The research were focused on the components embedded into four-layer PCBs with different structures of the inner layers. Three special capacitive laminates for manufacturing of thin-film embedded capacitors and several types of coils in the form of a spiral, meander and solenoid are described. In addition, a part of the spiral-type coils was formed with an aperture in the center in which the magnetic core, made of soft magnetic composites’ material was placed to increase the coil inductance. Findings – Various constructions of embedded capacitors and coils were designed and manufactured. Capacitance and loss tangent of capacitors to determine the repeatability of the production process were determined. Capacitor’s long-term stability analysis was performed by exposing test samples to elevated temperatures (70, 100 or 130°C), realized with the aid of heating plate, for at least 160 h. The temperature characteristics for the capacitance and loss tangent from 15 to 100°C were determined. Also the induction of different designs and layouts coils was determined. Originality/value – The wide parameters’ characterization of capacitors and coils embedded into PCBs allow the analysis of their properties with regard to their practical application. The promising results of the realized measurements show that the capacitors and induction coils with studied structures can be widely used in the construction of embedded circuits into PCBs (e.g. filters, radio frequency identification systems and generators).</abstract><cop>Bradford</cop><pub>Emerald Group Publishing Limited</pub><doi>10.1108/CW-03-2015-0009</doi><tpages>8</tpages></addata></record>
fulltext fulltext
identifier ISSN: 0305-6120
ispartof Circuit world, 2015-08, Vol.41 (3), p.125-132
issn 0305-6120
1758-602X
language eng
recordid cdi_crossref_primary_10_1108_CW_03_2015_0009
source ABI/INFORM global; Emerald:Jisc Collections:Emerald Subject Collections HE and FE 2024-2026:Emerald Premier (reading list)
subjects Aperture
Boards
Capacitance
Capacitors
Circuit boards
Circuit design
Circuits
Coiling
Coils
Construction
Copper
Design
Electrical & electronic engineering
Electrodes
Embedded structures
Embedded systems
Engineering
High temperature
Inductance
Induction coils
Inductors
Laminates
Layouts
Plates (structural members)
Printed circuits
Radio frequency identification
Reactance
Stability analysis
Standard deviation
Tangents
Temperature
Thin films
title Reactance components embedded in printed circuit boards
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-24T01%3A58%3A57IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Reactance%20components%20embedded%20in%20printed%20circuit%20boards&rft.jtitle=Circuit%20world&rft.au=St%C4%99plewski,%20Wojciech&rft.date=2015-08-03&rft.volume=41&rft.issue=3&rft.spage=125&rft.epage=132&rft.pages=125-132&rft.issn=0305-6120&rft.eissn=1758-602X&rft_id=info:doi/10.1108/CW-03-2015-0009&rft_dat=%3Cproquest_cross%3E2082166826%3C/proquest_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c295t-80427e78a9fbebcb8ace7be2dc199fef103dd38b8a3a2beea4cc06e1b5c437c13%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=2082166826&rft_id=info:pmid/&rfr_iscdi=true