Mechanical behaviors of 60/40 tin-lead solder lap joints

The authors present monotonic, fatigue, and creep-fatigue data for 60/40 tin-lead solder lap joints at room temperature. Monotonic tests performed include rapid-strain shear, creep, and stress relaxation tests. Fundamental data are presented for the strain range partitioning (SRP) approach to creep-...

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Bibliographic Details
Published in:IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1989-12, Vol.12 (4), p.459-468
Main Authors: Enke, N.F., Kilinski, T.J., Schroeder, S.A., Lesniak, J.R.
Format: Article
Language:English
Subjects:
Applied sciences
Capacitive sensors
Creep
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Fatigue
Frequency
Load flow control
Numerical analysis
Performance evaluation
Stress
Temperature
Testing
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Summary:The authors present monotonic, fatigue, and creep-fatigue data for 60/40 tin-lead solder lap joints at room temperature. Monotonic tests performed include rapid-strain shear, creep, and stress relaxation tests. Fundamental data are presented for the strain range partitioning (SRP) approach to creep-fatigue life prediction. SRP is found to model the solder creep-fatigue response adequately for the range of frequencies (0.007 to 0.5 Hz) and waveshapes tested. The elastic modulus and Poisson's ratio were determined to be 38.6 GPa and 0.36, respectively. Thorough experimental and numerical analyses of a sample 60/40 tin-lead solder lap joint revealed a complex strain state along the solder-copper interface. Fatigue lives for 0.5-Hz tests performed under load control correlate with the lives to 50% load drop for tests performed under strain control.< >
ISSN:0148-6411
1558-3082
DOI:10.1109/33.49002