High performance air cooled heat sinks for integrated circuits

A simple, compact, high-performance air cooling technology is described that combines laminar flow with certain heat-sink designs to achieve a cooling performance of

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Bibliographic Details
Published in:IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1990-12, Vol.13 (4), p.1022-1031
Main Authors: Hilbert, C., Sommerfeldt, S., Gupta, O., Herrell, D.J.
Format: Article
Language:English
Subjects:
Applied sciences
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Heat sinks
Heat transfer
Integrated circuit technology
Liquid cooling
Microchannel
Power dissipation
Semiconductor device packaging
Thermal conductivity
Thermal management
Trigeneration
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Description
Summary:A simple, compact, high-performance air cooling technology is described that combines laminar flow with certain heat-sink designs to achieve a cooling performance of
ISSN:0148-6411
1558-3082
DOI:10.1109/33.62544