Creep fatigue modeling for solder joint reliability predictions including the microstructural evolution of the solder

The effect of microstructural evolution on the mechanical integrity of solder joints is discussed. The modeling of the microstructural evolution processes of precipitation, dissolution, and coarsening of the tin phase for low-tin lead-tin solders is described. Thermal cycling fatigue is discussed. A...

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Bibliographic Details
Published in:IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1990-12, Vol.13 (4), p.727-735
Main Authors: Frost, H.J., Howard, R.T.
Format: Article
Language:English
Subjects:
Capacitive sensors
Creep
Fatigue
Microstructure
Predictive models
Soldering
Temperature
Thermal expansion
Thermal resistance
Thermal stresses
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Summary:The effect of microstructural evolution on the mechanical integrity of solder joints is discussed. The modeling of the microstructural evolution processes of precipitation, dissolution, and coarsening of the tin phase for low-tin lead-tin solders is described. Thermal cycling fatigue is discussed. A model for damage accumulation is shown.< >
ISSN:0148-6411
1558-3082
DOI:10.1109/33.62586