Design, modeling, and characterization of FET-SEED smart pixel transceiver arrays for optical backplanes

The design, modeling, and characterization of FET-SEED smart pixel transceiver arrays fabricated for application in optical backplanes are presented. Results of digital and analog measurements on 4/spl times/4 transmitter arrays and 4/spl times/4 receiver arrays, packaged at the printed circuit-boar...

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Bibliographic Details
Published in:IEEE journal of quantum electronics 1996-08, Vol.32 (8), p.1391-1398
Main Authors: Plant, D.V., Shang, A.Z., Otazo, M.R., Rolston, D.R., Robertson, B., Hinton, H.S.
Format: Article
Language:English
Subjects:
Applied sciences
Backplanes
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Integrated circuit interconnections
Optical arrays
Optical design
Optical receivers
Optical transmitters
Packaging
Printed circuits
Smart pixels
Transceivers
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Description
Summary:The design, modeling, and characterization of FET-SEED smart pixel transceiver arrays fabricated for application in optical backplanes are presented. Results of digital and analog measurements on 4/spl times/4 transmitter arrays and 4/spl times/4 receiver arrays, packaged at the printed circuit-board level, will be presented. In addition, these results will be compared to device and circuit models developed for these optoelectronics. Finally, the description of the successful application of these optoelectronics to interconnect two printed circuit boards will be described.
ISSN:0018-9197
1558-1713
DOI:10.1109/3.511552