Loading…
High-precision interconnect analysis
Integrated circuits have evolved to a stage where interconnections significantly limit their performance and functional complexity. We introduce a set of tools to perform highly accurate three-dimensional capacitance and resistance/thermal calculations of interconnect structures. We automatically ge...
Saved in:
Published in: | IEEE transactions on computer-aided design of integrated circuits and systems 1998-11, Vol.17 (11), p.1148-1159 |
---|---|
Main Authors: | , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Summary: | Integrated circuits have evolved to a stage where interconnections significantly limit their performance and functional complexity. We introduce a set of tools to perform highly accurate three-dimensional capacitance and resistance/thermal calculations of interconnect structures. We automatically generate these structures from layout information and a given process description. The main enhancement of our work is that we extract the interconnect characteristics after a complete and accurate topography simulation with previous optional lithography analysis, instead of elementary geometric blocks derived from simple analytical models. The capacitance and resistance/thermal extractor simulators are based on optimized finite-element methods, and the topography simulators use a cellular data-based approach. |
---|---|
ISSN: | 0278-0070 1937-4151 |
DOI: | 10.1109/43.736187 |