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High-precision interconnect analysis

Integrated circuits have evolved to a stage where interconnections significantly limit their performance and functional complexity. We introduce a set of tools to perform highly accurate three-dimensional capacitance and resistance/thermal calculations of interconnect structures. We automatically ge...

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Bibliographic Details
Published in:IEEE transactions on computer-aided design of integrated circuits and systems 1998-11, Vol.17 (11), p.1148-1159
Main Authors: Martins, R., Pyka, W., Sabelka, R., Selberherr, S.
Format: Article
Language:English
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Summary:Integrated circuits have evolved to a stage where interconnections significantly limit their performance and functional complexity. We introduce a set of tools to perform highly accurate three-dimensional capacitance and resistance/thermal calculations of interconnect structures. We automatically generate these structures from layout information and a given process description. The main enhancement of our work is that we extract the interconnect characteristics after a complete and accurate topography simulation with previous optional lithography analysis, instead of elementary geometric blocks derived from simple analytical models. The capacitance and resistance/thermal extractor simulators are based on optimized finite-element methods, and the topography simulators use a cellular data-based approach.
ISSN:0278-0070
1937-4151
DOI:10.1109/43.736187